Paul K Chu, City University of Hong Kong, Hong Kong
Paul K Chu received his BS in mathematics from The Ohio State University and MS and PhD in chemistry from Cornell University. His research spans a broad scope encompassing plasma surface engineering, materials science and engineering, as well as surface science. He is Chair Professor of Materials Engineering in the Department of Physics and Materials Science at City University of Hong Kong. He is a fellow of the American Physical Society (APS), American Vacuum Society (AVS), Institute of Electrical and Electronics Engineers (IEEE), and Materials Research Society (MRS). He is also a fellow of the Hong Kong Academy of Engineering Sciences (HKAES) and Hong Kong Institution of Engineers (HKIE). He has received more than 20 research awards and honors and a highly cited researcher in materials science according to Thomson Reuters.