About

Colloid and Interface Science is a central science, spanning many disciplines. As such, Colloid and Interface Sciences are key to a wide range of new technologies and new challenges; for example, energy generation and storage, nano-medicine and drug delivery, sensing and diagnostics, advanced materials, climate change and resource efficiency.

This meeting aims to attract international researchers to communicate and share the latest developments in these fast-moving and continually expanding fields.

The conference is being held in Shanghai in recognition of the significant and impressive contributions made by China to Colloid and Interface Sciences.  This conference venue will provide Attendees with unique opportunities to meet and learn from each other, to forge new scientific relationships and international collaborations.


Committee

Chair

Julian Eastoe, University of Bristol, UK

Local organizer

Gengfeng Zheng, Fudan University, Shanghai, China

Committee Members

Nicholas Abbott, University of Wisconsin at Madison, USA

Zbigniew Adamczyk, Jerzy Haber Institute of Catalysis and Surface Chemistry, Poland

Michele Adler, University Paris-Est, France

Alidad Amirfazli, York University, Canada

Teresa Bandosz, City University of New York, USA

Debora Berti, University of Florence, Italy

Lisa Biswal, Rice University, USA

John Brash, McMaster University, Canada

Per Claesson, Royal Institute of Technology (KTH), Sweden

Dganit Danino, Technion - Israel Institute of Technology, Israel

Wiebke Drenckhan, University Paris Sud, France

Eric Furst, University of Delaware, USA                        

Franz Grieser, University of Melbourne, Australia

Arthur Hubbard, Santa Barbara Science Project, USA

Luis Liz-Marzan, IKERBASQUE Basque Foundation for Science, Spain

Arturo Lopez-Quintela, University of Santiago de Compostela, Spain

Jian Lu, Manchester University, UK

Max Lu, University of Surrey, UK

Martin Malmsten, Uppsala University, Sweden

Raffaele Mezzenga, ETH Zurich, Switzerland

Reinhard Miller, Max Planck Institute of Colloids and Interfaces, Germany

Zhihong Nie, University of Maryland, USA

Maria Santore, University of Massachusetts, USA 

Pedro Tartaj, Instituto de Ciencia de Materiales de Madrid, Spain

Qian Yu, Soochow University, China

Gengfeng Zheng, Fudan University, China


Reasons to attend

  • Present your latest research
  • Learn from internationally renowned researchers
  • Understand the current state of research and the challenges to future discovery
  • Meet with international colleagues, make new friends
  • Visit the exhibition of leading-edge, commercial technologies
  • Grow your professional scientific network
  • Meet with fellow scientists from around the world and socialize at the Conference Dinner
  • Win the Best Poster Prize
  • In your free time explore the dynamic city of Shanghai with strong traditions, a vibrant present and an exciting future

High Quality Presentations
Our attendees continuously rate the quality of the presentations among the highest in the field.

Gender policy
The conference series has published its Gender policy

Young investigator perspectives
Oral slots are available specifically for Young Investigators (PhD students or Post-docs). Young Investigator Perspectives talks should be structured to include clear scientific justifications for the research, new results from the studies and explanations of how the research has advanced the field compared to existing literature. There will be opportunities for these Presenters to contribute Young Investigator Perspectives articles to Journal of Colloid and Interface Science, in consultation with the Editors.

Win the best poster prize 
The best Posters will be selected by the Scientific Committee, and prize winners will receive a certificate and free registration for the 2019 conference.

Post-conference publication
After the conference a selection of articles will be published in the Journal of Colloid and Interface Science, subject to the normal peer review process.


Conference deadlines

Abstract submission deadline - 2 February 2018

Early bird registration deadline - 6 April 2018