Nano-plating (III)

Nano-plating (III)

Database on the Microstructure of Plated Films

1st Edition - November 12, 2022

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  • Author: Tohru Watanabe
  • Hardcover ISBN: 9780323998949
  • eBook ISBN: 9780323999519

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Nano-plating (III): Database of Plated Film Microstructures completes the trilogy of nanoplating books written by Tohru Watanabe. Nanoplating (I) covers microstructure formation theory of plated films, with Nanoplating (II) covering a metallurgical approach to electrochemical theory and its applications to technology. This third installment shows the relationship between composition and microstructure of 27 pure metals and 55 alloy plating films, including electrodeposition and electroless plating and provides a database of plated film microstructures. The book presents readers with an efficient reference work that helps optimize their syntheses in order to obtain specific deposit types.

Key Features

  • Provides a database of plated film microstructures
  • Shows the relationship between composition and microstructure of 27 pure metals and 55 alloy plating films, including electrodeposition and electroless plating
  • Written by a real expert in the field who has over five decades of experience in metal electrodeposition and structural investigation


Researchers in University and Government Institutions and chemical engineers involved in electrochemical technology; Professionals in R&D and quality departments of electroplating companies

Table of Contents

  • 1. Preface

    2. Criteria for creating a plating film structural database

    2.1 Introduction

    2.2 Plating method

    2.2.1 Plating conditions

    2.2.2 Substrate material

    1) Rolled pure Cu polycrystalline plate

    2) Electrolytic Cu foil

    3) Single crystal Cu ({100}, {110}, {111} plane)

    4) Stainless steel (SUS-304) plate

    5) Electrodeposited Ni-P (about 25at% P) amorphous alloy plating film

    6) Liquid quenched amorphous alloy foil (Nippon Amorphous Metal Co. Fe-Si-B or Fe-Co-Si-B alloy)

    2.3 Indication of plated film crystallographic orientation

    2.4 Phase diagram

    3. Database on the structure of plated films (alphabetical order)

    3.1 Electrodeposited pure metal

    1-1) Electrodeposited Ag

    1-2) Electrodeposited Au

    1-3) Electrodeposited Bi

    1-4) Electrodeposited Cd

    1-5) Electrodeposited Co

    1-6) Electrodeposited Cr

    1-7) Electrodeposited Cu

    1-8) Electrodeposited Fe

    1-9) Electrodeposited In

    1-10) Electrodeposited Ni

    1-11) Electrodeposited Pd

    1-12) Electrodeposited Pt

    1-13) Electrodeposited Ru

    1-14) Electrodeposited Sn

    1-15) Electrodeposited Zn

    1-15-2) Effect of addition of anions and cations on Electrodeposited Zn

    3.2 Electrodeposited alloy

    2-1) Electrodeposited Ag-Cd

    2-1) Electrodeposited Ag-Co

    2-3) Electrodeposited Ag-Cu

    2-4) Electrodeposited Ag-Fe

    2-5) Electrodeposited Ag-Ni

    2-6) Electrodeposited Ag-Ni

    2-7) Electrodeposited Ag-Sn

    2-8) Electrodeposited Ag-Zn

    2-9) Electrodeposited Al-Mn

    2-10) Electrodeposited Au-Co

    2-11) Electrodeposited Au-Cu

    2-12) Electrodeposited Au-Ni

    2-13) Electrodeposited Au-Pd

    2-14) Electrodeposited Au-Sn

    2-15) Electrodeposited Cd-Sn

    2-16) Electrodeposited Cd-Zn

    2-17) Electrodeposited Co-Cu

    2-18) Electrodeposited Co-Fe

    2-19) Electrodeposited Co-Gd-O

    2-10) Electrodeposited Co-Mo

    2-21) Electrodeposited Co-Ni

    2-22) Electrodeposited Co-Pd

    2-23) Electrodeposited Co-Pt

    2-24) Electrodeposited Co-Sm-O

    2-25) Electrodeposited Co-Sn

    2-26) Electrodeposited Co-W

    2-27) Electrodeposited Cr-Fe

    2-28) Electrodeposited Cr-H

    2-29) Electrodeposited Cu-Ni

    2-30) Electrodeposited Cu-Pb

    2-31) Electrodeposited Cu-Sb

    2-32) Electrodeposited Cu-Zn

    2-34) Electrodeposited Fe-Mo

    2-35) Electrodeposited Fe-Ni

    2-36) Electrodeposited Fe-P

    2-37) Electrodeposited Fe-Pd

    2-38) Electrodeposited Fe-Pt

    2-39) Electrodeposited Fe-W

    2-40) Electrodeposited Fe-Zn

    2-41) Electrodeposited Ge-Pd

    2-42) Electrodeposited In-Sn

    2-43) Electrodeposited In-Zn

    2-44) Electrodeposited Ni-B

    2-45) Electrodeposited Ni-Mo

    2-46) Electrodeposited Ni-P

    2-47) Electrodeposited Ni-S

    2-48) Electrodeposited Ni-Sn

    2-49) Electrodeposited Ni-W

    2-50) Electrodeposited Ni-Zn

    2-51) Electrodeposited Sn-Zn

    3.3 Electroless deposited pure metal

    3-1) Electroless deposited Ag

    3-2) Electroless deposited Au

    3-3) Electroless deposited Co

    3-4) Electroless deposited Cu

    3-5) Electroless deposited Ni

    3.4 Electroless deposited alloy

    4.1) Electroless deposited Co-Ni

    4.2) Electroless deposited Ni-B

    4.3) Electroless deposited Ni-P

    3.5 Displacement pure metal

    5-0) Formation mechanism of displacement plated film

    5-1) Displacement Ag

    5-2) Displacement Ag

    5-3) Displacement Cd

    5-4) Displacement Cu

    5-5) Displacement Cu on Si substrate

    5-6) Displacement Pd

    5-7) Displacement Pd on Si substrate

    5-8) Displacement Zn

Product details

  • No. of pages: 804
  • Language: English
  • Copyright: © Elsevier 2022
  • Published: November 12, 2022
  • Imprint: Elsevier
  • Hardcover ISBN: 9780323998949
  • eBook ISBN: 9780323999519

About the Author

Tohru Watanabe

For many years, Tohru Watanabe worked in the Department of Applied Chemistry at Tokyo Metropolitan University. He is currently engaged in electrochemical engineering and technical consulting at the Watanabe Nano-Plating Laboratory. He organized the Nano plating Study Group and held 134 study sessions in 33 years and continues to do so. He is the author of Nano-Plating, published by Elsevier in 2004, and published many articles and several conference papers in international scientific journals, as well as several Japanese books. Tohru Watanabe graduated from Shibaura Institute of Technology. After researching on mechanical materials in the Department of Mechanical Engineering at Tokyo Metropolitan University, he moved to the Department of Industrial Chemistry and started research on plating from there. In 1976 be obtained a doctoral degree in Engineering from Tokyo Metropolitan University. Then he was a visiting researcher at University of Sussex in the UK, a visiting professor at Beijing Institute of Technology, a lecturer at Shibaura Institute of Technology, and Chuo University, and a researcher at the Tokyo Metropolitan Industrial Research Center.

Affiliations and Expertise

Watanabe Nano-Plating Laboratory, Atsugi, Kanagawa, Japan

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