Nano-plating (III)
Database on the Microstructure of Plated Films
Description
Key Features
- Provides a database of plated film microstructures
- Shows the relationship between composition and microstructure of 27 pure metals and 55 alloy plating films, including electrodeposition and electroless plating
- Written by a real expert in the field who has over five decades of experience in metal electrodeposition and structural investigation
Readership
Researchers in University and Government Institutions and chemical engineers involved in electrochemical technology; Professionals in R&D and quality departments of electroplating companies
Table of Contents
1. Preface
2. Criteria for creating a plating film structural database
2.1 Introduction
2.2 Plating method
2.2.1 Plating conditions
2.2.2 Substrate material
1) Rolled pure Cu polycrystalline plate
2) Electrolytic Cu foil
3) Single crystal Cu ({100}, {110}, {111} plane)
4) Stainless steel (SUS-304) plate
5) Electrodeposited Ni-P (about 25at% P) amorphous alloy plating film
6) Liquid quenched amorphous alloy foil (Nippon Amorphous Metal Co. Fe-Si-B or Fe-Co-Si-B alloy)
2.3 Indication of plated film crystallographic orientation
2.4 Phase diagram
3. Database on the structure of plated films (alphabetical order)
3.1 Electrodeposited pure metal
1-1) Electrodeposited Ag
1-2) Electrodeposited Au
1-3) Electrodeposited Bi
1-4) Electrodeposited Cd
1-5) Electrodeposited Co
1-6) Electrodeposited Cr
1-7) Electrodeposited Cu
1-8) Electrodeposited Fe
1-9) Electrodeposited In
1-10) Electrodeposited Ni
1-11) Electrodeposited Pd
1-12) Electrodeposited Pt
1-13) Electrodeposited Ru
1-14) Electrodeposited Sn
1-15) Electrodeposited Zn
1-15-2) Effect of addition of anions and cations on Electrodeposited Zn
3.2 Electrodeposited alloy
2-1) Electrodeposited Ag-Cd
2-1) Electrodeposited Ag-Co
2-3) Electrodeposited Ag-Cu
2-4) Electrodeposited Ag-Fe
2-5) Electrodeposited Ag-Ni
2-6) Electrodeposited Ag-Ni
2-7) Electrodeposited Ag-Sn
2-8) Electrodeposited Ag-Zn
2-9) Electrodeposited Al-Mn
2-10) Electrodeposited Au-Co
2-11) Electrodeposited Au-Cu
2-12) Electrodeposited Au-Ni
2-13) Electrodeposited Au-Pd
2-14) Electrodeposited Au-Sn
2-15) Electrodeposited Cd-Sn
2-16) Electrodeposited Cd-Zn
2-17) Electrodeposited Co-Cu
2-18) Electrodeposited Co-Fe
2-19) Electrodeposited Co-Gd-O
2-10) Electrodeposited Co-Mo
2-21) Electrodeposited Co-Ni
2-22) Electrodeposited Co-Pd
2-23) Electrodeposited Co-Pt
2-24) Electrodeposited Co-Sm-O
2-25) Electrodeposited Co-Sn
2-26) Electrodeposited Co-W
2-27) Electrodeposited Cr-Fe
2-28) Electrodeposited Cr-H
2-29) Electrodeposited Cu-Ni
2-30) Electrodeposited Cu-Pb
2-31) Electrodeposited Cu-Sb
2-32) Electrodeposited Cu-Zn
2-34) Electrodeposited Fe-Mo
2-35) Electrodeposited Fe-Ni
2-36) Electrodeposited Fe-P
2-37) Electrodeposited Fe-Pd
2-38) Electrodeposited Fe-Pt
2-39) Electrodeposited Fe-W
2-40) Electrodeposited Fe-Zn
2-41) Electrodeposited Ge-Pd
2-42) Electrodeposited In-Sn
2-43) Electrodeposited In-Zn
2-44) Electrodeposited Ni-B
2-45) Electrodeposited Ni-Mo
2-46) Electrodeposited Ni-P
2-47) Electrodeposited Ni-S
2-48) Electrodeposited Ni-Sn
2-49) Electrodeposited Ni-W
2-50) Electrodeposited Ni-Zn
2-51) Electrodeposited Sn-Zn
3.3 Electroless deposited pure metal
3-1) Electroless deposited Ag
3-2) Electroless deposited Au
3-3) Electroless deposited Co
3-4) Electroless deposited Cu
3-5) Electroless deposited Ni
3.4 Electroless deposited alloy
4.1) Electroless deposited Co-Ni
4.2) Electroless deposited Ni-B
4.3) Electroless deposited Ni-P
3.5 Displacement pure metal
5-0) Formation mechanism of displacement plated film
5-1) Displacement Ag
5-2) Displacement Ag
5-3) Displacement Cd
5-4) Displacement Cu
5-5) Displacement Cu on Si substrate
5-6) Displacement Pd
5-7) Displacement Pd on Si substrate
5-8) Displacement Zn
Product details
- No. of pages: 804
- Language: English
- Copyright: © Elsevier 2022
- Published: November 12, 2022
- Imprint: Elsevier
- Hardcover ISBN: 9780323998949
- eBook ISBN: 9780323999519