Nano-plating (III)

Database on the Microstructure of Plated Films

1st Edition - November 12, 2022
Author: Tohru Watanabe
Language: English
Hardback ISBN:
9 7 8 - 0 - 3 2 3 - 9 9 8 9 4 - 9
eBook ISBN:
9 7 8 - 0 - 3 2 3 - 9 9 9 5 1 - 9

Nano-plating (III): Database of Plated Film Microstructures completes the trilogy of nanoplating books written by Tohru Watanabe. Nanoplating (I) covers microstructure format… Read more

Purchase options

LIMITED OFFER

Save 50% on book bundles

Immediately download your ebook while waiting for your print delivery. No promo code is needed.

Institutional subscription on ScienceDirect

Request a sales quote

Nano-plating (III): Database of Plated Film Microstructures completes the trilogy of nanoplating books written by Tohru Watanabe. Nanoplating (I) covers microstructure formation theory of plated films, with Nanoplating (II) covering a metallurgical approach to electrochemical theory and its applications to technology. This third installment shows the relationship between composition and microstructure of 27 pure metals and 55 alloy plating films, including electrodeposition and electroless plating and provides a database of plated film microstructures. The book presents readers with an efficient reference work that helps optimize their syntheses in order to obtain specific deposit types.

1. Preface

2. Criteria for creating a plating film structural database

2.1 Introduction

2.2 Plating method

2.2.1 Plating conditions

2.2.2 Substrate material

1) Rolled pure Cu polycrystalline plate

2) Electrolytic Cu foil

3) Single crystal Cu ({100}, {110}, {111} plane)

4) Stainless steel (SUS-304) plate

5) Electrodeposited Ni-P (about 25at% P) amorphous alloy plating film

6) Liquid quenched amorphous alloy foil (Nippon Amorphous Metal Co. Fe-Si-B or Fe-Co-Si-B alloy)

2.3 Indication of plated film crystallographic orientation

2.4 Phase diagram

3. Database on the structure of plated films (alphabetical order)

3.1 Electrodeposited pure metal

1-1) Electrodeposited Ag

1-2) Electrodeposited Au

1-3) Electrodeposited Bi

1-4) Electrodeposited Cd

1-5) Electrodeposited Co

1-6) Electrodeposited Cr

1-7) Electrodeposited Cu

1-8) Electrodeposited Fe

1-9) Electrodeposited In

1-10) Electrodeposited Ni

1-11) Electrodeposited Pd

1-12) Electrodeposited Pt

1-13) Electrodeposited Ru

1-14) Electrodeposited Sn

1-15) Electrodeposited Zn

1-15-2) Effect of addition of anions and cations on Electrodeposited Zn

3.2 Electrodeposited alloy

2-1) Electrodeposited Ag-Cd

2-1) Electrodeposited Ag-Co

2-3) Electrodeposited Ag-Cu

2-4) Electrodeposited Ag-Fe

2-5) Electrodeposited Ag-Ni

2-6) Electrodeposited Ag-Ni

2-7) Electrodeposited Ag-Sn

2-8) Electrodeposited Ag-Zn

2-9) Electrodeposited Al-Mn

2-10) Electrodeposited Au-Co

2-11) Electrodeposited Au-Cu

2-12) Electrodeposited Au-Ni

2-13) Electrodeposited Au-Pd

2-14) Electrodeposited Au-Sn

2-15) Electrodeposited Cd-Sn

2-16) Electrodeposited Cd-Zn

2-17) Electrodeposited Co-Cu

2-18) Electrodeposited Co-Fe

2-19) Electrodeposited Co-Gd-O

2-10) Electrodeposited Co-Mo

2-21) Electrodeposited Co-Ni

2-22) Electrodeposited Co-Pd

2-23) Electrodeposited Co-Pt

2-24) Electrodeposited Co-Sm-O

2-25) Electrodeposited Co-Sn

2-26) Electrodeposited Co-W

2-27) Electrodeposited Cr-Fe

2-28) Electrodeposited Cr-H

2-29) Electrodeposited Cu-Ni

2-30) Electrodeposited Cu-Pb

2-31) Electrodeposited Cu-Sb

2-32) Electrodeposited Cu-Zn

2-34) Electrodeposited Fe-Mo

2-35) Electrodeposited Fe-Ni

2-36) Electrodeposited Fe-P

2-37) Electrodeposited Fe-Pd

2-38) Electrodeposited Fe-Pt

2-39) Electrodeposited Fe-W

2-40) Electrodeposited Fe-Zn

2-41) Electrodeposited Ge-Pd

2-42) Electrodeposited In-Sn

2-43) Electrodeposited In-Zn

2-44) Electrodeposited Ni-B

2-45) Electrodeposited Ni-Mo

2-46) Electrodeposited Ni-P

2-47) Electrodeposited Ni-S

2-48) Electrodeposited Ni-Sn

2-49) Electrodeposited Ni-W

2-50) Electrodeposited Ni-Zn

2-51) Electrodeposited Sn-Zn

3.3 Electroless deposited pure metal

3-1) Electroless deposited Ag

3-2) Electroless deposited Au

3-3) Electroless deposited Co

3-4) Electroless deposited Cu

3-5) Electroless deposited Ni

3.4 Electroless deposited alloy

4.1) Electroless deposited Co-Ni

4.2) Electroless deposited Ni-B

4.3) Electroless deposited Ni-P

3.5 Displacement pure metal

5-0) Formation mechanism of displacement plated film

5-1) Displacement Ag

5-2) Displacement Ag

5-3) Displacement Cd

5-4) Displacement Cu

5-5) Displacement Cu on Si substrate

5-6) Displacement Pd

5-7) Displacement Pd on Si substrate

5-8) Displacement Zn