Integrated Photonics: Application-Specific Design and Manufacturing Series
Aim & scope
This series synthesizes perspectives from both academia and industry on how to design, fabricate, and package & test photonic integrated circuits (PICs) by adapting leading-edge manufacturing technologies. The series will have a volume dedicated to each of the key applications areas of:
high-capacity data communications
smart sensing
high-speed wireless, and
augmented imaging.
The series charts a pedagogical progression (inspired by the Integrated Photonic System Roadmap) and elaborates a miniature curriculum to rapidly train engineering audiences in the most critical considerations for the entire supply-chain relevant to the applications areas listed above. Each volume focuses on one application area organized according to the predominant needs of that area’s high-impact systems, and collates expert contributions addressing three distinct sections:
Design principles and research findings for application-essential PIC device components
Description of the Figure-of-Merit for leading systems examples; proposal of canonical and/or systems-particular principles for AS-PIC circuit design and layout
Description of the operation and assessment of the performance specifications of keynote mass manufacturing tools along the industry supply-chain; proposal of proficiency rubrics to evaluate workforce skills in the context of a specific application.
Volumes in the Series
Integrated Photonics for Data Communication Applications edited by Madeleine Glick, Ling Liao, and Katharine Schmidtke
Integrated Photonics for Sensing Applications edited by Anu Agarwal, Benjamin Miller, and Juejun Hu (scheduled to publish in 2026)
Series Editors
The series is edited by Sajan Saini (MIT) and Lionel Kimerling (MIT).
