Integrated Photonics: Application-Specific Design and Manufacturing Series
Aim & scope
This series synthesizes perspectives from both academia and industry on how to design, fabricate, and package & test photonic integrated circuits (PICs) by adapting leading-edge manufacturing technologies. The series will have a volume dedicated to each of the key applications areas of:
high-capacity data communications
smart sensing
high-speed wireless, and
augmented imaging.
The series charts a pedagogical progression (inspired by the Integrated Photonic System Roadmap) and elaborates a miniature curriculum to rapidly train engineering audiences in the most critical considerations for the entire supply-chain relevant to the applications areas listed above. Each volume focuses on one application area organized according to the predominant needs of that area’s high-impact systems, and collates expert contributions addressing three distinct sections:
Design principles and research findings for application-essential PIC device components
Description of the Figure-of-Merit for leading systems examples; proposal of canonical and/or systems-particular principles for AS-PIC circuit design and layout
Description of the operation and assessment of the performance specifications of keynote mass manufacturing tools along the industry supply-chain; proposal of proficiency rubrics to evaluate workforce skills in the context of a specific application.
Volumes in the Series
Integrated Photonics for Sensing Applicationsopens in new tab/window edited by Anu Agarwal, Benjamin Miller, and Juejun Hu
Integrated Photonics for Data Communication Applicationsopens in new tab/window edited by Madeleine Glick, Ling Liao, and Katharine Schmidtke
Series Editors
The series is edited by Sajan Sainiopens in new tab/window (MIT) and Lionel Kimerlingopens in new tab/window (MIT).
