Tadatomo Suga

Tadatomo Suga joined the Max-Planck Institut für Metallforschung in 1979, and received the Ph.D. degree in materials science from University of Stuttgart in 1983. Since 1984 he has been a faculty member of the University of Tokyo, and since 1993, he has been a professor at the Department of Precision Engineering of the School of Engineering. He was also the director of Research Group of Interconnect Ecodesign at National Institute of Materials Science (NIMS), and a Member of Japan Council of Science, as well as the chair of IEEE CPMT Society Japan Chapter. His researches focus on micro-systems integration and packaging, and development of interconnect technology, especially the room temperature bonding technique for 3D integration. He has endeavored to establish collaboration between industries and academia for the packaging technology, directing R&D project of the Institute of Micro-System Integration (IMSI), and advocating also importance of the environmental aspects of packaging technology as the key organizer of Japanese roadmap of lead-free soldering and International Eco-design Conference as well as the general chair of IEEE Workshop on Low Temperature Bonding for 3D integration. In March, 2019, he retired from the University of Tokyo, and joined Meisei University as a professor of the Collaborative Research Center on April 1. 2019. He became also an Emeritus Professor of the University of Tokyo on June 18. 2019.