Fabless (no fabrication) IC (integrated circuit) techniques are growing rapidly and promise to become the standard method of IC manufacturing in the near future, this book will provide readers with what will soon be required knowledge of the subject. Other books on IC fabrication deal with the strictly physical process aspects of the topic and assume all factors in IC fabrication are under the control of the IC designing company. By contrast, this title recognizing that fabless IC design is often as much about managing business relationships as it is about physical processes. “Fabless” ICs are those designed and marketed by one company but actually manufactured by another.

Key Features

*Written by board members of the Fabless Semiconductor Association, an industry consortium that include Xilinx, Intersil, Micro Linear, and many other members *Approriate for a wide range of integrated circuit (IC) designers and users who need to understand the fabless process and its advantages/limitations *Discusses important topics such as negotiating with outside fabrication companies, choosing the right electronic design tools, protection of intellectual property and business plans, and maintaining quality control


IC engineers, design engineers (analog and digital), engineering management.

Table of Contents

PART 1 – Manufacturing Strategies: Understanding Fabless IC Technology Chapter 1: More than a Decade of Transition in the Semiconductor Industry 1.1 FSA is Established 1.2 Early Success 1.3 Early Success Trend Continues 1.4 Semiconductor Business Models 1.5 Outsourcing Will Accelerate 1.6 IDMs are Going Fabless 1.7 A Case Study: Cypress Semiconductor 1.8 More IDMs are Outsourcing 1.9 Geographic Manufacturing Centers Chapter 2: Fabless Semiconductor Manufacturing 2.1 Foundry Revenue Growth 2.2 Semiconductor Back-End Services 2.3 Semiconductor Equipment Chapter 3: Qualities of Successful Fabless Companies 3.1 Defining Events for the Fabless Market 3.2 Thriving in the Fabless Model 3.3 Key Qualities for Success 3.4 The Future of Fabless PART 2 – An In-Depth Understanding of the Fabless Semiconductor Business Model Chapter 4: Semiconductor Manufacturing Basics 4.1 Semiconductor Processes 4.2 Semiconductor Manufacturing Steps 4.3 Wafer Size 4.4 Manufacturing Costs 4.5 Conclusion Chapter 5: Fabless ASICs 2.1 Introduction 5.2 Origins of the ASIC Industry 5.3 Emergence of the Fabless ASIC Business Model 5.4 The Fabless ASIC Model: How It Works 5.5 The Services and Capabilities of a Fabless ASIC Supplier 5.6 Conclusion Chapter 6: Electronic Design Automation 6.1 Fabless EDA Overview 6.2 Fabless EDA Selection Process 6.3 Physical Design EDA Chapter 7: Intellectual Property


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© 2007
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About the authors

Lisa Tafoya

Affiliations and Expertise

Fabless Semiconductor Association