Modern Ion Plating Technology

Modern Ion Plating Technology

Fundamentals and Applications

1st Edition - September 28, 2022

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  • Authors: Fuzhen Wang, Junwei Wu
  • eBook ISBN: 9780323908344
  • Paperback ISBN: 9780323908337

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Description

Modern Ion Plating Technology: Fundamentals and Applications discusses the fundamental concepts of plasma physics in various coating technologies and explores its development and implementation into new technologies. Recent progress of technologies and products via ion plating will be introduced. The book begins with the treatment of vacuum physics, through plasma physics. It then presents the various forms of ion plating, before concluding with a section presenting examples of applications where ion plating is employed. Through the material presented in this book, the reader gains an understanding of the importance of ion plating technology to human progress and its various potential applications. Under the guidance of plasma physics knowledge, how to use electric and electromagnetic fields to control the space plasma will be critical to the development of new technology and systems.

Key Features

  • Presents both the principle and processes of various ion plating technology
  • Introduces the fundamental physics of ion plating
  • Includes the application of ion plating technology in high-tech products

Readership

Materials Scientists and Engineers, Post-grad Students, Chemists

Table of Contents

  • 1. Introduction of Ion Plating Technology
    1.1 New Requirements for High-tech Products
    1.2 Definition of Ion Plating Technology
    1.3 Characteristics of Ion Plating Technology
    1.4 Classification of Ion Plating Technology

    2. Fundamental of Vacuum Physics
    2.1 Definition of Vacuum
    2.2 Vacuum Level and Classifications
    2.3 Basic Law of Gas kinetics
    2.4 Gas Molecule and Surface Action
    2.5 Electron Emission from Cathode Surface

    3. Fundamental of Plasma Physics
    3.1 Overview of Plasma
    3.2 Definition of plasma
    3.3 Acquisition of Vacuum Plasma
    3.4 Classification of Plasmas
    3.5 Low Pressure Gas Discharge
    3.5.1 Motion of Charged Particles in Gas
    3.5.2 Law of Collision between Particles
    3.5.3 Ionization and Excitation of Gas
    3.5.4 Elimination of Charged Particles
    3.5.5 Plasma chemistry
    3.6 3.6 Development Process of Gas Discharge
    3.6.1 Development Process of Gas Discharge
    3.6.2 Equivalent Anode
    3.6.3 Ignition Conditions of Gas Discharge
    3.7 Volt-Ampere Properties of Gas Discharge
    3.8 Glow Discharge
    3.8.1 Characteristics of Glow Discharge
    3.8.2 Cathode potential drop
    3.8.3 Normal and Abnormal Glow Discharges
    3.8.4 Characteristic zone of glow discharge electrodes
    3.8.5 Hollow cathode effect
    3.8.6 High Frequency Glow Discharge
    3.9 Arc discharge
    3.9.1 Characteristics of Arc discharge
    3.9.2 Classification of Arc Discharge
    3.9.3 Volt Ampere Properties of Arc Discharge
    3.9.4 Hot Electron Arc Discharge
    3.9.5 Cold Self-sustaining Arc Discharge
    3.10 Interaction of Charged Particles and Electrodes
    3.10.1 Interaction of Ion and Cathode
    3.10.2 Interaction of Electrons with Anode
    3.11 Motion of Charged Particles in Electromagnetic Field
    3.11.1 Motion of Charged Particles in Electric Field
    3.11.2 Motion of Charged Particles in Magnetic Field
    3.11.3 Motion of Charged Particles in Electromagnetic Field
    3.11.4 Application of Electromagnetic Field in Coating systems

    4. Classification of Vacuum Plating Technology
    4.1 Introduction of Vacuum Plating Technology
    4.2 Significance of Vacuum Plating Technology
    4.3 Classification of Vacuum Plating
    4.4 Characteristics of Physical Vapor Deposition
    4.5 Characteristics of Chemical Vapor Deposition

    5. Vacuum Evaporation Plating
    5.1 Physical Significance for Vacuum Evaporation
    5.2 Classification of Evaporation Plating
    5.3 Vacuum Evaporation systems
    5.4 Microstructure of Evaporative Coatings

    6. Glow discharge Ion plating
    6.1 Overview of Glow Discharge Ion Plating
    6.2 Principle of Dipolar Glow Discharge Ion Plating
    6.3 Dipolar Glow Discharge Ion Plating Process
    6.4 Microstructure of Dipolar Glow Discharge Ion Plating
    6.5 Characteristics of Dipolar Glow Discharge Ion Plating
    6.6 Development of Glow Discharge Ion Plating

    7. Hot Arc Ion Plating
    7.1 Principle of Hollow Cathode Ion Plating
    7.1.1 Introduction of Hollow Cathode Ion Plating
    7.1.2 Technical Process of Hollow Cathode Ion Plating
    7.1.3 Microstructure of Hollow Cathode coatings
    7.1.4 Technical characteristics of hollow cathode ion plating
    7.1.5 Electromagnetic Field in Hollow Cathode Ion Plating
    7.2 Hot Wire Arc Ion Plating
    7.2.1 Introduction of Hot Wire Arc Ion Plating
    7.2.2 Technical Process of Hot Wire Arc Ion Plating
    7.2.3 Electromagnetic Field in Hot Wire Arc Ion Plating

    8. Cathodic Arc Ion Plating
    8.1 Cathodic Arc Devices
    8.2 Technical Process of Arc Ion Plating
    8.3 Mechanism of Arc Ion Plating
    8.4 Measures to filter macroparticles from Arc Ion plating
    8.5 Shapes of Cathodic Arc Sources
    8.6 Microstructure Characteristics of Arc Ion Plating
    8.7 Technical Characteristics of Arc Ion Plating
    8.8 Pulse Bias in Arc Ion Plating
    8.9 Progress of Arc Ion Plating

    9. Magnetron Sputtering Technology
    9.1 Principle of Sputtering
    9.2 Technical Process of Sputtering
    9.3 Magnetron Sputtering Technology 
    9.4 Shapes of Magnetron Sputtering Targets
    9.5 Microstructure of Magnetron Sputtered coatings
    9.6 Progress of Magnetron Sputtering Technology
    9.6.1 Balanced and Unbalanced Magnetron Sputtering
    9.6.2 Unbalanced Closed Magnetic Field
    9.6.3 Mid-Frequency Power Supply and Twin Targets
    9.6.4 High Power Impulse Magnetron Sputtering Technology

    10. Plasma chemical vapor deposition (CVD)
    10.1 Introduction of CVD
    10.1.1 Thermal CVD
    10.1.2 Metal organic chemical vapor deposition (MOCVD)
    10.1.3 Atomic Layer Deposition
    10.2 Plasma Assisted Chemical Vapor Deposition (PACVD)
    10.2.1 Principle of PACVD
    10.2.2 Glow Discharge PACVD
    10.2.3 Roll to roll PACVD
    10.2.4 Arc discharged PACVD

    11. Function of Charged Particle Beams in Plating
    11.1 Function of Ion Beam
    11.1.1 Energy of Ion Beam
    11.1.2 Ion Beam Assisted Deposition
    11.2 Function of Arc electric Current
    11.2.1 Applications of Arc electric current for ionization
    11.2.2 Arc Electric Current Assisted Deposition
    11.2.3 Hot Electron Enhanced Ion Nitriding Technology

    12. Application of Ion Plating
    12.1 Hard Coatings
    12.1.1 Requirements for Coated Tools in High-end Processing Industry
    12.1.2 Types of Hard Coated Tools
    12.1.3 New Application of Hard Coating
    12.1.4 New Requirements for Hard Coatings
    12.1.5 Development of Hard Coating for wear Resistant Parts
    12.2 Protective coatings
    12.2.1 Anticorrosive Coating
    12.2.2 Thermal Barrier Coating
    12.3 Optical coatings
    12.3.1 Antireflective coating
    12.3.2 Reflectance coating
    12.3.3 Electrochromic Glass
    12.3.4 Hydrophobic and hydrophilic coating
    12.3.5 Other optical coatings
    12.4 Coatings in Solar Energy
    12.4.1 Photothermal Conversion coating
    12.4.2 Photoelectric Conversion coating
    12.5 Integrated Circuit production
    12.5.1 Integrated Circuit
    12.5.2 Discrete Device Processing
    12.6 Information Display Devices
    12.6.1 Flat Panel Display Devices
    12.6.2 Flexible Microelectronic Devices
    12.6.3 Information Memory Devices
    12.7 Decorative Products
    12.7.1 Watches related Metallic Decorations
    12.7.2 Plastic Decorations
    12.8 New Applications on Flexible Substrates
    12.8.1 Capacitors
    12.8.2 High barrier coatings
    12.8.3 Shielding coatings
    12.8.4 Nickel coatings for Ni-MH Batteries
    12.8.5 Flexible Solar Cell coatings
    12.8.6 Flexible Microelectronic Devices
    12.8.7 Flexible foldable Large Screen Display

Product details

  • No. of pages: 550
  • Language: English
  • Copyright: © Elsevier 2022
  • Published: September 28, 2022
  • Imprint: Elsevier
  • eBook ISBN: 9780323908344
  • Paperback ISBN: 9780323908337

About the Authors

Fuzhen Wang

Prof. Fuzhen Wang graduated from Beijing Institute of Iron and Steel in 1960, majoring in metallographic heat treatment. She began her career with the Beijing University of Technology. In 1984, she transferred to the College of Mechanical Engineering, Beijing Union University, and was promoted to Professor in 1988. In 1991, she was recognized as an outstanding expert in Beijing and enjoyed the subsidies of the State Council. Professor Wang began to study "ion plating technology" in 1976. In 1978, the first ARE (activated reactive evaporation) equipment was successfully developed in China. Professor Wang has authored two books: Surface Deposition Technology, published in 1989 and Applied Technology of Gas Deposition, 2007. In addition, in 2014 she developed a video tutorial entitled, Ion Coating Technology.

Affiliations and Expertise

Professor, College of Mechanical Engineering, Beijing Union University, China

Junwei Wu

Prof. Junwei Wu is an associate professor in Harbin Institute of Technology (Shenzhen) and also serves as a deputy secretary general of Shenzhen Association of Vacuum Technology Industries (SAVTI), and is a member of the international advisory board of Society of Vacuum Coaters (SVC). He obtained his Ph.D. from West Virginia University in 2009 and has published more than 50 journal papers on both ion plating technology and mass production.

Affiliations and Expertise

Associate Professor, Harbin Institute of Technology, Shenzhen, Guangdong, China

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