This book covers all aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the book is on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications.
The book covers subjects seldom treated in the literature: substrate characterization, adhesion, cleaning and the processing. The book also covers the widely discussed subjects of vacuum technology and the fundamentals of individual deposition processes. However, the author uniquely relates these topics to the practical issues that arise in PVD processing, such as contamination control and film growth effects, which are also rarely discussed in the literature. In bringing these subjects together in one book, the reader can understand the interrelationship between various aspects of the film deposition processing and the resulting film properties. The author draws upon his long experience with developing PVD processes and troubleshooting the processes in the manufacturing environment, to provide useful hints for not only avoiding problems, but also for solving problems when they arise. He uses actual experiences, called ""war stories"", to emphasize certain points. Special formatting of the text allows a reader who is already knowledgeable in the subject to scan through a section and find discussions that are of particular interest. The author has tried to make the subject index as useful as possible so that the reader can rapidly go to sections of particular interest. Extensive references allow the reader to pursue subjects in greater detail if desired.
The book is intended to be both an introduction for those who are new to the field and a valuable resource to those already in the field. The discussion of transferri
Engineers, including surface engineering personnel, technicians, and other plant personnel in process industries such as semiconductors and microelectronics. Especially informative for those new to the field.
- Introduction 1.1 Surface Engineering 1.2 Thin Film Processing 1.3 Process Documentation 1.4 Safety and Environmental Concerns 1.5 Units 1.6 Summary
- Substrate (""Real"") Surfaces and Surface Modification 2.1 Introduction 2.2 Materials and Fabrication 2.3 Atomic Structure and Atom-Particle Interactions 2.4 Characterization of Surfaces and Near-Surface Regions 2.5 Bulk Properties 2.6 Modification of Substrate Surfaces 2.7 Summary
- The Low-Pressure Gas and Vacuum Processing Environment 3.1 Introduction 3.2 Gases and Vapors 3.3 Gas-Surface Interactions 3.4 Vacuum Environment 3.5 Vacuum Processing Systems 3.6 Vacuum Pumping 3.7 Vacuum and Plasma Compatible Materials 3.8 Assembly 3.9 Evaluating Vacuum System Performance 3.10 Purchasing a Vacuum System for PVD Processing 3.11 Cleaning of Vacuum Surfaces 3.12 System-Related Contamination 3.13 Process-Related Contamination 3.14 Treatment of Specific Materials 3.15 Safety Aspects of Vacuum Technology 3.16 Summary
- The Low-Pressure Plasma Processing Environment 4.1 Introduction 4.2 The Plasma 4.3 Plasma-Surface Interactions 4.4 Configurations for Generating Plasmas 4.5 Ion and Plasma Sources 4.6 Plasma Processing Systems 4.7 Plasma-Related Contamination 4.8 Some Safety Aspects of Plasma Processing 4.9 Summary
- Vacuum Evaporation and Vacuum Deposition 5.1 Introduction 5.2 The
- No. of pages:
- © William Andrew 1998
- 31st December 1998
- William Andrew
- eBook ISBN:
- Hardcover ISBN:
Technical Director, Society of Vacuum Coaters, Albuquerque, NM, USA
If you are new to PVD as I am, you will find this book to be well worth the money. - Amazon.com Review