Handbook of Deposition Technologies for Films and Coatings

This second edition, edited by the world-renowned Dr. Rointain Bunshah, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. Considerably more material was added in Plasma Assisted Vapor Deposition processes, as well as Metallurgical Coating Applications.

Engineers, technicians, and plant personnel in the semiconductor and related industries.

1. Deposition Technologies: An Overview
   1.0 The Market
   2.0 Introduction
   3.0 Aim and Scope
   4.0 Definitions and Concepts
   5.0 Physical Vapor Deposition (PVD) Process Terminology
   6.0 Classification of Coating Processes
   7.0 Gas Jet Deposition with Nano-Particles
   8.0 Microstructure and Properties
   9.0 Unique Features of Deposited Materials and Gaps In Understanding
   10.0 Current Applications
   11.0 ""Frontier Areas"" for the Application of the Products of Deposition Technology
   12.0 Selection Criteria
   13.0 Summary
   Appendix 1: Deposition Process Definitions
   References
   2. Plasmas in Deposition Processes
   1.0 Introduction
   2.0 Particle Motion
   3.0 Collective Phenomena
   4.0 Plasma Discharges
   5.0 Plasma Volume Reactions
   6.0 Surface Reactions
   References
   3. Surface Preparation for Film and Coating Deposition Processes
   1.0 Introduction
   2.0 Contamination
   3.0 Environment Control
   4.0 Cleaning Processes
   5.0 Drying and Outgassing
   6.0 Monitoring of Cleaning
   7.0 In Situ Cleaning
   8.0 Plasmas
   9.0 Storage and Handling
   10.0 Activation and Sensitization
   11.0 Surface Modification
   12.0 Passivation and Preservation
   13.0 Safety
   References
   4. Evaporation: Processes, Bulk Microstructures and Mechanical Properties
   1.0 General Introduction
   2.0 Scope
   3.0 PVD Processes
   4.0 Theory and Mechanisms
   5.0 Evaporation Process and Apparatus
   6.0 Evaporation Sources
   7.0 Laser Induced Evaporation/Laser Ablation/Pulsed Laser Deposition (PLD)
   8.0 Deposition Rate Monitors and Process Control
   9.0 Deposition of Various Materials
   10.0 Microstructure of PVD Condensates
   11.0 Physical Properties of Thin Films
   12.0 Mechanical and Related Properties
   13.0 Purification of Metals by Evaporation
   Appendix
   References
   5. Sputter Deposition Processes
   1.0 Introduction
   2.0 Sputtering Mechanisms
   3.0 Sputter Deposition Techniques
   4.0 Sputter Deposition Modes
   References
   6. Ion Plating
   1.0 Introduction
   2.0 Processing Plasma
   3.0 Generation of Plasmas
   4.0 Plasma Chemistry
   5.0 Bombardment Effects on Surfaces
   6.0 Sources of Depositing Atoms
   7.0 Reactive Ion Plating
   8.0 Bombardment Effects on Film Properties
   9.0 Ion Plating System Requirements
   10.0 Process Monitoring and Control
   11.0 Problem Areas
   12.0 Applications
   13.0 Summary
   References
   7. Chemical Vapor Deposition
   1.0 Introduction
   2.0 Important Reaction Zones in CVD
   3.0 Design of CVD Experiments
   4.0 Gas Flow Dynamics
   5.0 Rate-Limiting Steps During CVD
   6.0 Reaction Mechanisms
   7.0 Nucleation
   8.0 Surface Morphology and Microstructure of CVD Materials
   9.0 Selective Deposition
   10.0 Some Applications of the CVD Technique
   11.0 Outlook
   References
   8. Plasma-Enhanced Chemical Vapor Deposition
   1.0 Introduction
   2.0 Reactor Influence on Plasma Behavior
   3.0 Films Deposited by CVD
   References
   9. Plasma-Assisted Vapor Deposition Processes: Overview
   1.0 Introduction
   2.0 Plasma-Assisted Deposition Processes
   3.0 Model of a Deposition Process
   4.0 Materials Deposited by Reactive Vapor Deposition Processes
   5.0 Key Issues in Plasma-Assisted Reactive Vapor Deposition Processes
   6.0 Plasma-Assisted Deposition Techniques in Current Usage
   7.0 Limitations of Current Plasma-Assisted Techniques
   8.0 Hybrid Processes
   9.0 Conclusions
   References
   10. Deposition from Aqueous Solutions: An Overview
   1.0 Introduction
   2.0 General Principles
   3.0 Electrodeposition
   4.0 Processing Techniques
   5.0 Selection of Deposit
   6.0 Selected Special Processes
   7.0 Structures and Properties of Deposits
   8.0 Summary
   Appendix A: Preparation of Substrates for Electroplating
   Appendix B: Representative Electroless Plating Solution Formulation
   Appendix C: Comparison of Aluminum Anodizing Processes (Types I, II and III)
   References
   11. Advanced Thermal Spray Deposition Techniques
   1.0 Introduction
   2.0 Equipment and Processes
   3.0 Total Coating Process
   4.0 Coating Structure and Properties
   5.0 Summary
   References
   12. Non-Elemental Characterization of Films and Coatings
   1.0 Introduction
   2.0 Characterization
   3.0 Film Formation
   4.0 Elemental And Structural Analysis
   5.0 Some Property Measurements
   6.0 Summary
   References
   13. Nucleation, Film Growth, and Microstructural Evolution
   1.0 Introduction
   2.0 Nucleation and the Early Stages of Film Growth
   3.0 Computer Simulations of Microstructure Evolution
   4.0 Microstructure Evolution and Structure-Zone
   5.0 Effects of Low-Energy Ion Irradiation During Film Growth
   References
   14. Metallurgical Applications
   1.0 Introduction
   2.0 Corrosion
   3.0 Galvanic Corrosion
   4.0 EMF and Galvanic Series
   5.0 Coatings for Galvanic Corrosion
   6.0 Methods of Deposition of Metallic Coatings
   7.0 Examples of Corrosion-Resistant Coatings
   8.0 High Temperature Oxidation/Corrosion
   9.0 Friction and Wear
   10.0 Coatings to Reduce Friction and Wear
   References
   15. Characterization of Thin Films and Coatings
   1.0 Introduction
   2.0 Surface Analysis Techniques
   3.0 Imaging Analysis Techniques
   4.0 Optical Analysis Techniques
   References
   16. Jet Vapor Deposition
   1.0 Introduction
   2.0 Principles and Apparatus of JVD
   3.0 Discussion
   4.0 Examples of JVD Films and Applications
   5.0 Summary
   References
   Index