Embedded Mechatronic Systems, Volume 1 - 1st Edition - ISBN: 9781785480133, 9780081004845

Embedded Mechatronic Systems, Volume 1

1st Edition

Analysis of Failures, Predictive Reliability

Authors: Abdelkhalak El Hami Philippe Pougnet
eBook ISBN: 9780081004845
Hardcover ISBN: 9781785480133
Imprint: ISTE Press - Elsevier
Published Date: 10th July 2015
Page Count: 262
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Description

In operation, mechatronics embedded systems are stressed by loads of different causes: climate (temperature, humidity), vibration, electrical and electromagnetic. These stresses in components which induce failure mechanisms should be identified and modeled for better control. AUDACE is a collaborative project of the cluster Mov'eo that address issues specific to mechatronic reliability embedded systems. AUDACE means analyzing the causes of failure of components of mechatronic systems onboard. The goal of the project is to optimize the design of mechatronic devices by reliability.

The project brings together public sector laboratories that have expertise in analysis and modeling of failure, major groups of mechatronics (Valeo and Thales) in the automotive and aerospace and small and medium enterprises that have skills in characterization and validation tests

Key Features

  • Find and develop ways to characterize and validate the design robustness and reliability of complex mechatronic devices
  • Develop ways to characterize physical and chemical phenomena
  • Identify mechanisms of failure of components of these devices
  • Analyze the physical and chemical mechanisms of failure, in order of importance
  • Model failure mechanisms and design optimization

Readership

Academics and students (masters and doctoral students), teachers and researchers, industry Major Groups and SMEs in the automotive and aerospace sectors

Table of Contents

  • Preface
  • 1: Reliability-Based Design Optimization
    • Abstract
    • 1.1 Introduction
    • 1.2 Reliability-based design optimization
    • 1.3 Conclusion
  • 2: Non-Destructive Characterization by Spectroscopic Ellipsometry of Interfaces in Mechatronic Devices
    • Abstract
    • 2.1 Introduction
    • 2.2 Relationship between the ellipsometric parameters and the optical characteristics of a sample
    • 2.3 Rotating component or phase modulator ellipsometers
    • 2.4 Relationship between ellipsometric parameters and intensity of the detected signal
    • 2.5 Analysis of experimental data
    • 2.6 The stack structural model
    • 2.7 The optical model
    • 2.8 Application of ellipsometry technique
    • 2.9 Conclusion
  • 3: Method of Characterizing the Electromagnetic Environment in Hyperfrequency Circuits Encapsulated within Metallic Cavities
    • Abstract
    • 3.1 Introduction
    • 3.2 Theory of metallic cavities
    • 3.3 Effect of metal cavities on the radiated emissions of microwave circuits
    • 3.4 Approximation of the electromagnetic field radiated in the presence of the cavity from the electromagnetic field radiated without cavity
    • 3.5 Conclusion
  • 4: Metrology of Static and Dynamic Displacements and Deformations Using Full-Field Techniques
    • Abstract
    • 4.1 Introduction
    • 4.2 Speckle interferometry
    • 4.3 Moiré projection
    • 4.4 Structured light projection
    • 4.5 Conclusion
  • 5: Characterization of Switching Transistors under Electrical Overvoltage Stresses
    • Abstract
    • 5.1 Introduction
    • 5.2 Stress test over ESD/EOV electric constraints
    • 5.3 Simulation results
    • 5.4 Experimental setup
    • 5.5 Conclusion
  • 6: Reliability of Radio Frequency Power Transistors to Electromagnetic and Thermal Stress
    • Abstract
    • 6.1 Introduction
    • 6.2 The GaN technology
    • 6.3 Radiated electromagnetic stress
    • 6.4 RF CW continuous stress
    • 6.5 Thermal exposure
    • 6.6 Combined stresses: RF CW + electromagnetic (EM) and electric + EM
    • 6.7 Conclusion
  • 7: Internal Temperature Measurement of Electronic Components
    • Abstract
    • 7.1 Introduction
    • 7.2 Experimental setup
    • 7.3 Measurement results
    • 7.4 Conclusion
  • 8: Reliability Prediction of Embedded Electronic Systems: The FIDES Guide
    • Abstract
    • 8.1 Introduction
    • 8.2 Presentation of the FIDES guide
    • 8.3 FIDES calculation on an automotive mechatronic system
    • 8.4 Conclusion
  • 9: Study of the Dynamic Contact between Deformable Solids
    • Abstract
    • 9.1 Introduction
    • 9.2 Preliminaries
    • 9.3 Main results
    • 9.4 Proposed numerical method
    • 9.5 Numerical results
    • 9.6 Conclusion
  • List of Authors
  • Index
  • Summary of Volume 2: Analysis of Failures, Modeling, Simulation and Optimization

Details

No. of pages:
262
Language:
English
Copyright:
© ISTE Press - Elsevier 2015
Published:
Imprint:
ISTE Press - Elsevier
eBook ISBN:
9780081004845
Hardcover ISBN:
9781785480133

About the Author

Abdelkhalak El Hami

Abdelkhalak El Hami is Professeur des universités at the Institut National des Sciences Appliquées (INSA-Rouen) in France and is in charge of the Normandy Conservatoire National des Arts et Metiers (CNAM) Chair of Mechanics and Head of the department of mechanical engineering of INSA Normandy, as well as several European pedagogical projects. He is an expert in fluid–structure interaction studies, reliability and optimization.

Affiliations and Expertise

Institut National des Sciences Appliquees (INSA-Rouen), France

Philippe Pougnet

Expert in reliability and product-process technology at Valeo, Philippe Pougnet is a doctor-engineer of the Scientific and Medical University of Grenoble and an INPG engineer. He is responsible for the management of the reliability of mechatronic systems manufactured in mass production.

Affiliations and Expertise

VeDeCom, Valeo, Paris, France