Development of Packaging and Products for Use in Microwave Ovens - 2nd Edition - ISBN: 9780081027134

Development of Packaging and Products for Use in Microwave Ovens

2nd Edition

Editors: Ulrich Erle Peter Pesheck Matthew Lorence
Paperback ISBN: 9780081027134
Imprint: Woodhead Publishing
Published Date: 1st November 2019
Page Count: 500
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Table of Contents

Part 1 – Principles
1. Electromagnetic basis of microwave heating
2. Influence of food geometry and dielectric properties on heating performance
3. Advanced topics in microwave heating uniformity - Theory and Experimental Methods
4. Microwave ovens
5. Measurements of dielectric properties of food and associated materials
6. Microwave dielectric properties of food and some other substances

Part 2 – Microwave packaging materials and design
7. Passive microwave packaging forms
8. Susceptors in microwave packaging
9. Shielding and field modification – thick metal films

Part 3 – Product development, food, packaging and oven safety
10. Flavors and colors for microwave foods
11. Texture modifying ingredients for microwave foods
12. Package and product development testing in a microwave oven
13. Sensory Science for Microwaveable Products
14. Food Safety and Cooking Validation
15. The impact of Solid State Technology on product development
16. Regulatory issues in microwave packaging
17. Microwave oven safety

Part 4 – Modelling of microwave heating
18. Modelling of cavities and Loads with FDTD and FEM Methods
19. Space-discrete modelling of microwave susceptors
20. Problems in the modelling of magnetron - fed ovens
21. Special regimes for modelling ovens fed by solid - state sources


Description

Development of Packaging and Products for Use in Microwave Ovens, Second Edition supports the efficient design of microwaveable food products and packaging materials, explaining all essential aspects in a detailed and systematic way. This new edition reviews recent developments and the latest cutting-edge technology, including new materials and package formats, new ideas for product development, and new information on developments in microwave technology. Sections cover the effect of food dielectric properties and heating uniformity, microwave packaging materials, product development, food, packaging, oven safety, and the computer modelling of microwave products and active packaging.

Written by a distinguished team of international contributors, this book is not only a valuable resource for engineers, manufacturers and product developers in the food and packaging industries, but also a great research tool for industrial R&D and academia.

Key Features

  • Enables the reader to understand product and packaging materials for microwave ovens down to a highly technical and detailed level
  • Offers systematic coverage on all aspects involved, including principles, materials, design, product development and modelling
  • Includes the very latest developments in products and packaging, including smart packaging and solid state technology

Readership

Scientists, engineers, technicians and product developers in the packaging or food industries; industrial R&D; academic researchers and students across food science and materials


Details

No. of pages:
500
Language:
English
Copyright:
© Woodhead Publishing 2020
Published:
Imprint:
Woodhead Publishing
Paperback ISBN:
9780081027134

Ratings and Reviews


About the Editors

Ulrich Erle Editor

Ulrich Erle is an expert for cooking technologies and food science at the Nestlé Development Center in Solon/Ohio. During his assignments as project manager and senior scientific advisor he gained experience in the industrial application of microwaves in vacuum drying and sterilization processes. More recently, he concentrated on the performance of food products for household microwave ovens, including innovative packaging solutions. Ulrich is a member of the Board of Governors of the International Microwave Power Institute (IMPI) and also chaired the 50th IMPI Symposium in Orlando. He represents Nestlé in the Center for Advanced Processing and Packaging Studies (CAPPS) and in the RF Energy Alliance.

Affiliations and Expertise

the Nestlé Development Center in Solon/Ohio

Peter Pesheck Editor

Peter Pesheck is currently Principal at Food Biophysics, LLC. In his 34-year R&D career at Pillsbury and General Mills he worked primarily in cross-business Strategic Technology groups, where he specialized in structure-function relationships, microscopy, modeling, microwave heating (food dielectric properties, simulation, product design and problem resolution), and wheat flour doughs and their structural transformations in proofing and baking. He has published 4 papers in reviewed journals and holds 19 U.S. patents.

Affiliations and Expertise

General Mills, USA

Matthew Lorence Editor

Matthew Lorence is currently a Packaging Technology Manager at Bellisio Foods, Inc. He is a leader in the field of packaging R&D for consumer and industrial products, and medical devices. He was previously Packaging Technology Manager at General Mills. He holds 13 U.S. patents and has extensive experience in identifying, developing, and commercializing convenient Total Product Offerings leveraging Open Innovation for new packaging and product technologies.

Affiliations and Expertise

Packaging Technology Manager at Bellisio Foods, Inc