Characterization of Integrated Circuit Packaging Materials - 1st Edition - ISBN: 9780750692670, 9781483292342

Characterization of Integrated Circuit Packaging Materials

1st Edition

Editors: Thomas Moore
eBook ISBN: 9781483292342
Imprint: Newnes
Published Date: 20th August 1993
Page Count: 274
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Description

Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

Readership

Practicing engineers and researchers working with IC packages

Table of Contents

IC packaging reliability; Mold compound adhesion and strength; Mechanical stress in IC packages; Moisture sensitivity of plastic packages; Thermal management in IC packages; Electrical performance of IC packages; Solderability; Hermeticity; Advanced interconnect technology.

Details

No. of pages:
274
Language:
English
Copyright:
© Newnes 1993
Published:
Imprint:
Newnes
eBook ISBN:
9781483292342

About the Editor

Thomas Moore

Affiliations and Expertise

Texas Instruments