Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Practicing engineers and researchers working with IC packages
IC packaging reliability; Mold compound adhesion and strength; Mechanical stress in IC packages; Moisture sensitivity of plastic packages; Thermal management in IC packages; Electrical performance of IC packages; Solderability; Hermeticity; Advanced interconnect technology.
- No. of pages:
- © Newnes 1993
- 20th August 1993
- eBook ISBN: