Electromigration in Thin Films and Electronic Devices
Materials and Reliability
- Choong-Un Kim, University of Texas at Arlington, USA
Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.
With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field.
Materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field.
- Published: August 2011
- Imprint: Woodhead Publishing
- ISBN: 978-1-84569-937-6