Advances in CMP Polishing Technologies

Edited by

  • Toshiro Doi, Professor of Manufacturing Processes, Department of Mechanical Engineering, Kyushu University, Japan
  • Ioan D. Marinescu, University of Toledo, OH, USA
  • Syuhei Kurokawa

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community.

Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience.

Building on the fundamentals of tribology – the science of friction, wear and lubrication – the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.

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Mechanical and electrical engineers in the precision manufacturing and semiconductor industries; scientists and engineers working in the fields of CMP, polishing and tribology.


Book information

  • Published: December 2011
  • ISBN: 978-1-4377-7859-5

Table of Contents

Chapter 1: Introduction

Chapter 2: Device fabrication with a silicon crystal substrate

Chapter 3: Ultra-precision technology – taking silicon single crystal as an example

Chapter 4: Applications of ultra-precision CMP in device processes

Chapter 5: The future of processing technology

Chapter 6: Progress of the semiconductor and silicon industries

Chapter 7: Summary