Advances in CMP Polishing Technologies
- Toshiro Doi, Professor of Manufacturing Processes, Department of Mechanical Engineering, Kyushu University, Japan
- Ioan D. Marinescu, University of Toledo, OH, USA
- Syuhei Kurokawa
Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience.
Building on the fundamentals of tribology – the science of friction, wear and lubrication – the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.
AudienceMechanical and electrical engineers in the precision manufacturing and semiconductor industries; scientists and engineers working in the fields of CMP, polishing and tribology.
- Published: December 2011
- Imprint: WILLIAM ANDREW
- ISBN: 978-1-4377-7859-5
Table of Contents
Chapter 1: Introduction
Chapter 2: Device fabrication with a silicon crystal substrate
Chapter 3: Ultra-precision technology – taking silicon single crystal as an example
Chapter 4: Applications of ultra-precision CMP in device processes
Chapter 5: The future of processing technology
Chapter 6: Progress of the semiconductor and silicon industries
Chapter 7: Summary