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| MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
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Editor:
S. Zaima
See editorial board for all editors information
Description
Materials Science in Semiconductor Processing provides a unique and much needed forum for the discussion
of experimental and theoretical materials research stimulated by and applied to semiconductor processing.
Each issue will aim to
provide a snapshot of current comprehension, new achievements, breakthroughs and future trends in such fields as ion implantation, diffusion
and gettering, process and equipment modelling, metallization and interconnects, packaging, etc, which are the backbone of semiconductor
device processing.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation
for dopant engineering; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; ultra low energy implantation:
physics, limitations and perspectives; gettering procedures for ULSI; advanced metallization and interconnects schemes; thin dielectric
layer, oxidation; cleaning procedures for ULSI devices; compound semiconductor processing; physical modelling of processing (ion implantation,
metal deposition, oxidation, etching, etc.): molecular dynamics, ab-initio methods, Monte Carlo, etc.; new physical models in commercial
simulation platforms for the design and modelling of advanced devices; equipment modelling; new materials and processes for discrete
and integrated circuits; heterostructures and quantum devices; engineering of the electrical and optical the properties of semiconductors;
crystal growth: mechanisms, reliability, defect density intrinsic impurities and defects.
Bibliographic & ordering information
ISSN: 1369-8001
Imprint: PERGAMON
Subscriptions for the year 2009,
Volume 12,
6 issues
Also available as part of Solid-State Electronics
Institutional online access: ScienceDirect eSelect
For purchase of online access to this journal on ScienceDirect.
Institutional price: Order form
EUR 488 for European countries and Iran
JPY 64,800 for Japan
USD 548 for all countries except Europe, Japan and Iran
Conditions of sale & ordering procedures, and links to our regional sales offices.
For an overview of recently-dispatched issues, see the Journal issue
dispatch dates
Combined subscriptions
Materials Science in Semiconductor Processing with Solid-State Electronics (Combined Subscription)
Audience
For materials scientists, applied solid state physicists, surface scientists, electrochemists, electronic engineers.
Impact factor of this journal
2007: 0.655
© Journal Citation Reports 2008, published by Thomson Reuters
607/589
Last update: 4 Sep 2008
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