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Acta Mechanica Solida Sinica

Acta Mechanica Solida Sinica
ISSN: 0894-9166
Imprint: ELSEVIER
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Statistics
Impact Factor: 0.552
5-Year Impact Factor: 0.618
Issues per year: 6

Editorial Board


Contact the Editor


Editor-in-Chief

Q.S. Zheng (Quanshui Zheng)
Tsinghua University, China, Email: zhengqs@tsinghua.edu.cn

Associate Editor-in-Chief

C. Wang (Cheng Wang)
Huazhong University of Science and Technology, China, Email: wangch@mail.hust.edu.cn
Y.G. Wei (Yueguang Wei)
Institute of Mechanics, Chinese Academy of Sciences, China, Email: ywei@lnm.imech.ac.cn
Y.T. Hu (Yuantai Hu)
Huazhong University of Science and Technology, China, Email: hudeng@263.net
Y.S. Wang (Yuesheng Wang)
Beijing Jiaotong University, China, Email: yswang@bjtu.edu.cn

Editorial Board

Y.L. Bai (Yilong Bai)
Institute of Mechanics, Chinese Academy of Sciences, China, Email: baiyl@lnm.imech.ac.cn
G.D. Cheng (Gengdong Cheng)
Dalian University of Technology, China, Email: chenggd@dlut.edu.cn
K.P. Chong (Pen K Chong)
National Science Foundation, USA, Email: kchong@nsf.gov
S.Y. Du (Shanyi Du)
Harbin Institute of Technology, China, Email: sydu@hit.edu.cn
D.N. Fang (Daining Fang)
Tsinghua University, China, Email: fangdn@tsinghua.edu.cn
J. Fang (Jing Fang)
Peking University, China, Email: jfang@pku.edu.cn
X.Q. Feng (Xiaoqiao Feng)
Tsinghua University, China, Email: fengxq@tsinghua.edu.cn
Y.B. Fu (Yibin Fu)
University of Keele, UK, Email: y.fu@keele.ac.uk
H.J. Gao (Huajian Gao)
Brown University, USA, Email: Huajian_Gao@brown.edu
Q-C. He (Qichang He)
Universite de Marne-la-Vallee, France, Email: qichang.he@univ-paris-est.fr
Y.G. Huang (Yonggnag Huang)
University of Illinois at Urbana-Champaign, USA, Email: huang9@uiuc.edu
Q. Jiang (Qing. Jiang)
University of California, USA, Email: qjiang@engr.ucr.edu
Z.H. Li (Zhen.Huan. Li)
Huazhong University of Science and Technology, China, Email: zhenhuanli@mail.hust.edu.cn
K.M. Liew (Kim Meow LIEW)
City University of Hong Kong, China, Email: kmliew@cityu.edu.hk
R.H. Liu (Ren-huai LIU)
Jinan University, China, Email: lrh@jnu.edu.cn
J. Lu (Jian LU)
The Hong Kong Polytechnic University, China, Email: mmmelu@inet.polyu.edu.hk
T.J. Lu (Tian.Jian. Lu)
Xi'an Jiaotong University, China, Email: tjlu@mail.xjtu.edu.cn
Y-W. Mai (Yiu-Wing Mai)
The University of Sydney, Australia, Email: mai@aeromech.usyd.edu.au
G. Maier (Giulio Maier)
Technical University (Politecnico) of Milan, Italy, Email: giulio.maier@polimi.it
J.Q. Sun (Jian-Qiao Sun)
University of California, Merced, USA, Email: jqsun@ucmerced.edu
Z.G. Suo (Zhi.Gang. Suo)
Harvard University, USA, Email: suo@seas.harvard.edu
X.P. Wu (Xiao.Ping. Wu)
University of Science and Technology of China, Email: xpwu@ustc.edu.cn
H.P. Xie (He.Ping. Xie)
Sichuan University, China, Email: xiehp@scu.edu.cn
W. Yang (Wei. Yang)
Zhejiang University, China, Email: yw-dem@tsinghua.edu.cn
X.J. Zheng (Xiao.Jing. Zheng)
Lanzhou University, China, Email: xjzheng@lzu.edu.cn
Z. Zhong (Zheng. Zhong)
Tongji University, China, Email: zhongk@mail.tongji.edu.cn
W.Q. Zhu (Wei.Qiu. Zhu)
Zhejiang University, China, Email: wqzhu@yahoo.com

International Advisory Editorial Board

Aifantis, EC (Elias, C.)
Aristotle University of Thessaloniki, Greece, Email: mom@mom.gen.auth.gr
Atluri, SN (Satya N.)
University of California, Irvine, USA, Email: satluri@uci.edu
Batra, RC (Romesh C. Batra)
Virginia Polytechnic Institute and State University, USA, Email: rbatra@vt.edu
Battatraya, K (Kaushik Bhattacharya)
California Institute of Technology, USA, Email: bhatta@caltech.edu
Belytschko, T (Ted)
Northwestern University, USA, Email: t-belytschko@nwu.edu
Bertram, A (Albrecht)
Magdeburg University, Germany, Email: Albrecht.Bertram@Masch-Bau.Uni-Magdeburg.DE
Beskos, DE (Demetrios)
University of Patras, Greece, Email: d.e.beskos@upatras.gr.
Casciati, F (Fabio)
University of Pavia, Italy, Email: fabio@dipmec.unipv.it
Chaboche, JL (Jean-Louis)
Office National d'Etudes et de Recherches Aerospatiales, France, Email: Jean-Louis.Chaboche@onera.fr
van der Giessen, E (Erik)
University of Groningen, The Netherlands, Email: E.van.der.Giessen@rug.nl
Horii, H (HORII, Hideyuki)
University of Tokyo, Japan, Email: horii@civil.t.u-tokyo.ac.jp
Hsia, KJ (K Jimmy Hsia)
University of Illinois at Urbana-Champaign, USA, Email: kjhsia@uiuc.edu
Huang, YY(Yuying, Huang)
Huazhong University, China of Science and Technology, Email: yyhuang@mail.hust.edu.cn
Hutchinson, JW (John. W. Hutchinson)
Harvard University, USA, Email: hutchinson@husm.harvard.edu
Kyriakides, S (Stelios Kyriakides)
University of Texas at Austin, USA, Email: skk@mail.utexas.edu
Lee, JD (James D. Lee)
George Washington University, USA, Email: jdlee@gwu.edu
Maiti, SK (Surjya Kumar Maiti)
Indian Institute of Technology, Bombay (Mumbai), India, Email: skmaiti@me.iitb.ac.in
Nikita F. Morozov
Saint-Petersburg State University, Russia, Email: morozov@nm1016.spb.edu
Nikitin, LV
Institute of Physics of the Earth, Russian Academy of Sciences, Russia, Email: nikitin@magn.ru
Nobutada OHNO
Nagoya University, Japan, Email: ohno@mech.nagoya-u.ac.jp
Ray W. Ogden
University of Glasgow, UK, Email: rwo@maths.gla.ac.uk
Batmanathan Dayanand (Daya) Reddy
University of Cape Town, South Africa, Email: Daya.Reddy@uct.ac.za
Reddy, JN
Texas A and M University, USA, Email: jnreddy@tamu.edu
Schiehlen, Werner
University of Stuttgart, Germany, Email: schiehlen@itm.uni-stuttgart.de
Schnack, Eckart
University of Karlsruhe, Germany, Email: eckart.schnack@mach.uni-karlsruhe.de
Shih, CF (Choon Fong Shih)
King Abdullah University of Science and Technology, Saudi Arabia, Email: uprshih@nus.edu.sg
Sun, CT (Chin-The Sun)
Purdue University, USA, Email: sun@purdue.edu
Suresh, S (Subra Suresh)
Massachusetts Institute of Technology, USA, Email: ssuresh@mit.edu
Taylor, RE (Rodney Eatock Taylor)
Oxford University, UK, Email: r.eatocktaylor@eng.ox.ac.uk
Weng, GJ (George J Weng)
Rutgers University New Brunswick, USA, Email: weng@jove.rutgers.edu
Willis, JR (John R Willis)
University of Cambridge, UK, Email: J.R.Willis@damtp.cam.ac.uk
Yu, SW (Shouwen Yu)
Tsinghua University, China, Email: yusw@tsinghua.edu.cn
Yu, TX (Tongxi Yu)
The Hong Kong University of Science and Technology, Email: metxyu@ust.hk
 
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