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Pervasive and Mobile Computing

Pervasive and Mobile Computing
ISSN: 1574-1192
Imprint: ELSEVIER
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Issues per year: 6

Editorial Board


Contact the Editor


Editors:


Editor-in-Chief

Sajal K. Das
University of Texas at Arlington, Arlington, TX, USA, Email: das@cse.uta.edu

Associate Editor-in-Chief

M. Conti
Consiglio Nazionale Delle Ricerche (IIT-CNR), Pisa, Italy

Editor-in-Chief Special Issues

B.A. Shirazi
Washington State University, Pullman, WA, USA

Area Editors:

G. Anastasi
Università di Pisa, Pisa, Italy, Email: g.anastasi@iet.unipi.it
C. Becker
Universität Mannheim, Mannheim, Germany, Email: christian.becker@uni-mannheim.de
C. Bisdikian
IBM T.J. Watson Research Center, Hawthorne, NY, NY, USA, Email: bisdik@us.ibm.com
A. Boukerche
University of Ottawa, Ottawa, ON, Canada, Email: boukerch@site.uottawa.ca
T. Camp
Colorado School of Mines, Golden, CO, USA, Email: tcamp@mines.edu
J. Cao
Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, Email: csjcao@comp.polyu.edu.hk
M. Chalmers
University of Glasgow, Glasgow, UK, Email: matthew@dcs.gla.ac.uk
D.J. Cook
Washington State University, Pullman, WA, USA, Email: cook@eecs.wsu.edu
J. Indulska
University of Queensland, Brisbane, QLD, Australia, Email: jaga@itee.uq.edu.au
H. Karl
Universität-Gesamthochschule Paderborn, Paderborn, Germany, Email: holger.karl@uni-paderborn.de
D. Kotz
Dartmouth College, Hanover, NH, USA, Email: kotz@cs.dartmouth.edu
B. Krishnamachari
University of Southern California (USC), Los Angeles, CA, USA, Email: bkrishna@usc.edu
M. Kumar
University of Texas at Arlington, Arlington, TX, USA, Email: mkumar@uta.edu
S.F. Midkiff
National Science Foundation, Arlington, VA, USA, Email: smidkiff@nsf.gov
A. Misra
IBM T.J. Watson Research Center, Hawthorne, NY, NY, USA, Email: archan@us.ibm.com
R. Molva
Institut EURECOM, Valbonne - Sophia Antipolis, France, Email: refik.molva@eurecom.fr
M. Mutka
Michigan State University (MSU), East Lansing, USA, Email: mutka@cse.msu.edu
L.M. Ni
Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong, Email: ni@cs.ust.hk
G.P. Picco
Universita di Trento, Povo, Italy, Email: picco@dit.unitn.it
G. Roussos
Birkbeck College, University of London, London, England, UK, Email: g.roussos@dcs.bbk.ac.uk
A. Schmidt
Universität Duisburg-Essen, Essen, Germany, Email: Albrecht.Schmidt@icb.uni-due.de
R. Steinmetz
Technische Universität Darmstadt, Darmstadt, Germany, Email: Ralf.Steinmetz@KOM.tu-darmstadt.de
G. Tröster
Eidgenössische Technische Hochschule Zürich (ETH), Zürich, Switzerland, Email: troester@ife.ee.ethz.ch
F. Zambonelli
Università degli Studi di Modena e Reggio Emilia, Reggio Emilia, Italy, Email: franco.zambonelli@unimore.it
 
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