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Computer Communications

The International Journal for the Computer and Telecommunications Industry

Computer Communications
ISSN: 0140-3664
Imprint: ELSEVIER
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Statistics
Impact Factor: 0.884
5-Year Impact Factor: 1.005
Issues per year: 18

Editorial Board


Contact the Editor


Editor-in-Chief:

M. Conti
Institute for Informatics and Telematics (IIT), Consiglio Nazionale Delle Ricerche (IIT-CNR), Via G. Moruzzi, 1, 56124 Pisa, Italy, Fax: +39 050 315 2593, Tel: + 39 050 315 3062, Email: marco.conti@iit.cnr.it

Co-Editor-in-Chief:

M. Atiquzzaman
School of Computer Science, University of Oklahoma, 200 Felgar Street, EL 154, Norman, OK 73019-6151, USA, Email: atiq@ou.edu

Area Editors:

E. Altman
INRIA, Sophia-Antipolis, France, Email: Eitan.Altman@sophia.inria.fr
P.D. Amer
University of Delaware, Newark, DE, USA, Email: amer@cis.udel.edu
G. Anastasi
Università di Pisa, Pisa, Italy, Email: g.anastasi@iet.unipi.it
L. Andrew
Swinburne University of Technology, Hawthorn, VIC, Australia, Email: l.andrew@ieee.org
N. Ansari
New Jersey Institute of Technology, Newark, NJ, USA, Email: Nirwan.Ansari@njit.edu
N. Asokan
Nokia Research Center, Helsinki, Finland, Email: asokan@acm.org
C.M. Assi
Concordia University, Montreal, QC, Canada, Email: assi@ece.concordia.ca
G. Bianchi
Università di Roma "Tor Vergata", Rome, Italy, Email: giuseppe.bianchi@uniroma2.it
F. Boavida
Universidade de Coimbra, Coimbra, Portugal, Email: boavida@dei.uc.pt
L. Bononi
Università di Bologna, Bologna, Italy, Email: bononi@cs.unibo.it
T. Braun
Universität Bern, Berne, Switzerland, Email: braun@iam.unibe.ch
F. Bu Sung Lee
Nanyang Technological University, Singapore, Singapore, Email: EBSLEE@ntu.edu.sg
L. Buttyan
Budapest University of Technology and Economics, Budapest, Hungary, Email: buttyan@crysys.hu
T. Camp
Colorado School of Mines, Golden, CO, USA, Email: tcamp@mines.edu
A. Capone
Politecnico di Milano, Milano, Italy, Email: capone@elet.polimi.it
M. Cardei
Florida Atlantic University, Boca Raton, FL, USA, Email: mihaela@cse.fau.edu
M. Chatterjee
University of Central Florida, Orlando, FL, USA, Email: mainak@eecs.ucf.edu
C-F. Chiasserini
Politecnico di Torino, Torino, Italy, Email: chiasserini@polito.it
S. Choi
Seoul National University, Seoul, South Korea, Email: schoi@snu.ac.kr
S. Chong
Korea Advanced Institute of Science and Technology (KAIST), Yuseong-Gu, Daejeon, South Korea, Email: song@ee.kaist.ac.kr
J. Crowcroft
University of Cambridge, Cambridge, England, UK, Email: Jon.Crowcroft@cl.cam.ac.uk
S.K. Das
University of Texas at Arlington, Arlington, TX, USA, Email: das@cse.uta.edu
S. Fahmy
University of California, Santa Barbara CA, USA, Email: fahmy@cs.purdue.edu
S. Fdida
Université Pierre et Marie Curie (Paris VI), Paris, France, Email: serge.fdida@lip6.fr
C. Fragouli
École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland, Email: christina.fragouli@epfl.ch
X. Fu
Georg-August Universität Göttingen, Göttingen, Germany, Email: fu@cs.uni-goettingen.de
S. Giordano
SUPSI, Manno, Switzerland, Email: silvia.giordano@supsi.ch
I. Guerin-Lassous
Université Claude Bernard - Lyon I, Lyon, France, Email: Isabelle.Guerin-Lassous@ens-lyon.fr
M. Hassan
University of New South Wales, Sydney, Australia, Email: mahbud@cse.unsw.edu.au
P.J.M. Havinga
Universiteit Twente, Enschede, Netherlands, Email: havinga@cs.utwente.nl
M. Hofmann
Bell Laboratories Holmdel, Holmdel, NJ, USA, Email: hofmann@bell-labs.com
D. Hutchison
Lancaster University, Bailrigg, Lancaster, UK, Email: dh@comp.lancs.ac.uk
W. Jia
City University of Hong Kong, Kowloon Tong, Hong Kong, Email: wei.jia@cityu.edu.hk
H. Karl
Universität-Gesamthochschule Paderborn, Paderborn, Germany, Email: holger.karl@uni-paderborn.de
S.K. Katsikas
University of Piraeus, Pireaus, Greece, Email: ska@aegean.gr
P. Koutsakis
Technical University of Crete, Crete, Greece, Email: polk@telecom.tuc.gr
M.M. Krunz
University of Arizona, Tucson, AZ, USA, Email: krunz@ece.arizona.edu
M. Kumar
University of Texas at Arlington, Arlington, TX, USA, Email: mkumar@uta.edu
M.A. Labrador
University of South Florida, Tampa, FL, USA, Email: labrador@cse.usf.edu
G. Leduc
Université de Liège, Liège, Belgium, Email: leduc@montefiore.ulg.ac.be
V.C.M. Leung
University of British Columbia at Vancouver, Vancouver, BC, Canada, Email: vleung@ece.ubc.ca
M. Li
Shanghai Jiao Tong University, Shanghai, China, Email: li-ml@cs.sjtu.edu.cn
A. Liu
Michigan State University (MSU), East Lansing, MI, USA, Email: alexliu@cse.msu.edu
J. Lopez-Muñoz
Universidad de Malaga, Malaga, Spain, Email: jlm@lcc.uma.es
P. Mähönen
Rheinisch-Westfälische Technische Hochschule Aachen (RWTH), Aachen, Germany, Email: pma@mobnets.rwth-aachen.de
M. Maier
INRS Énergie, Matériaux et Télécommunications, Montréal, QC, Canada, Email: maier@ieee.org
M. May
Thomson Paris Research Lab, Paris, France, Email: martin.may@thomson.net
M. Merabti
Liverpool John Moores University, Liverpool, UK, Email: m.merabti@livjm.ac.uk
R. Molva
Institut EURECOM, Valbonne - Sophia Antipolis, France, Email: refik.molva@eurecom.fr
E. Monteiro
Universidade de Coimbra, Coimbra, Portugal, Email: edmundo@dei.uc.pt
J. Neuman de Souza
Universidade Federal do Ceará, Fortaleza, Ceará, Brazil, Email: neuman.souza@gmail.com
C. Nita-Rotaru
Purdue University, West Lafayette, IN, USA, Email: crisn@cs.purdue.edu
M.S. Obaidat
Monmouth University, W. Long Branch, NJ, USA, Email: obaidat@monmouth.edu
J. Ott
Helsinki University of Technology (TKK), Helsinki, Finland, Email: jo@netlab.tkk.fi
H. Schulzrinne
Columbia University, New York, NY, USA, Email: hgs@cs.columbia.edu
V. Siris
University of Crete, Heraklion, Greece, Email: vsiris@ics.forth.gr
I. Stavrakakis
University of Athens, Athens, Ilisia, Greece, Email: ioannis@di.uoa.gr
R. Steinmetz
Technische Universität Darmstadt, Darmstadt, Germany, Email: Ralf.Steinmetz@KOM.tu-darmstadt.de
V.R. Syrotiuk
Arizona State University, Tempe, USA, Email: syrotiuk@asu.edu
G. Tsudik
University of California at Irvine, Irvine, USA, Email: gts@ics.uci.edu
S. Uhlig
Technische Universität Berlin (TUB), Berlin, Germany, Email: steve@net.t-labs.tu-berlin.de
L.C. Wolf
Technische Universität Carola-Wilhelmina zu Braunschweig, Braunschweig, Germany, Email: wolf@ibr.cs.tu-bs.de
A. Wolisz
Technische Universität Berlin (TUB), Berlin, Germany, Email: awo@ieee.org
J. Wu
Florida Atlantic University, Boca Raton, FL, USA, Email: jie@cse.fau.edu
G. Zaruba
University of Texas at Arlington, Arlington, TX, USA, Email: zaruba@uta.edu
S. Zeadally
University of the District of Columbia, Washington, DC, USA, Email: szeadally@udc.edu
J. Zhang
University of Bedfordshire, Luton, England, UK, Email: jie.zhang@beds.ac.uk
L. Zhang
Nanyang Technological University, Singapore, Email: elzhang@ntu.edu.sg
X. Zhou
University of Colorado at Colorado Springs, Colorado Springs, CO, USA, Email: zbo@cs.uccs.edu
M. Zukerman
City University of Hong Kong, Cheung Sha Wan, Kowloon, Hong Kong, Email: m.zu@cityu.edu.hk
 
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