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Signal Processing

An International Journal

Signal Processing
ISSN: 0165-1684
Imprint: ELSEVIER
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Impact Factor: 1.256
Issues per year: 12

Editorial Board



Editor-in-Chief

B. Ottersten
Royal Institute of Technology (KTH), Stockholm, Sweden, Email: Bjorn.Ottersten@ee.kth.se

Editorial Board

P. Abry
École Normale Supérieure de Lyon, Lyon Cedex 07, France
A.K. Barros
Universidade Federal do Maranhao, Sao Luis, Brazil
T. Blu
Chinese University of Hong Kong, Shatin, New Territories, Hong Kong
H. Boche
Fraunhofer Institut für Nachrichtentechnik, Berlin, Germany
T.D. Bui
Concordia University, Montréal, PQ, Canada
A. Carini
Università degli Studi de Urbino, Urbino, Italy
A.E. Cetin
Bilkent University, Bilkent, Ankara, Turkey
R. Chellappa
University of Maryland, College Park, MD, USA
S. Chen
University of Southampton, Southampton, UK
C.Y. Chi
National Tsing Hua University, Hsinchu, Taiwan
P. Comon
Universite de Nice-Sophia Antipolis, Sophia-Antipolis Cedex, France
P.L. Correia
Universidade Técnica de Lisboa, São João De Deus, Lisboa, Portugal
T-B. Deng
Toho University, Chiba, Japan
U.B. Desai
Indian Institute of Technology, Bombay, India
Z. Ding
University of Pittsburgh, Davis, CA, USA
K. Dogancay
University of South Australia, Adelaide, SA, Australia
Y. Eldar
Technion - Israel Institute of Technology, Haifa, Israel
J.R. Fonollosa
Universitat Politécnica de Catalunya Barcelona, Spain
X. Gao
Xidian University, Xi'an, China
A.B. Gershman
Technische Universität Darmstadt, Darmstadt, Germany
G.B. Giannakis
University of Minnesota, Minneapolis, USA
F. Gini
Università di Pisa, Pisa, Italy
B. Guoan
Nanyang Technological University, Singapore, Singapore
A. Hanssen
University of Tromsø, Tromsø, Norway
X. He
Zhejiang University, Hangzhou, China
U. Heute
Christian-Albrechts-Universität zu Kiel (CAU), KIEL, Germany
Y. Hua
University of California at Riverside, Riverside, CA, USA
M. Jansen
K.U. Leuven, Leuven, Belgium
S.H. Jensen
Aalborg University, Aalborg, Denmark
M. Jiang
Peking University, Beijing, China
M. Kieffer
SUPELEC Ecole Superieure D'Electricite - Univ. Paris Sud, Gif-sur-Yvette Cedex, France
B. Kleijn
Royal Institute of Technology (KTH), Stockholm, Sweden
V. Koivunen
Helsinki University of Technology (TKK), Finland
X. Li
Birkbeck College, University of London, London, England, UK
P. Loubaton
Université de Marne-la-Vallée, Marne La Vallee, France
G. Matz
Technische Universität Wien, Wien, Austria
M. Mihaylova
Lancaster University, Lancaster, England, UK
M. Moonen
Katholieke Universiteit Leuven, Heverlee, Belgium
A. Napolitano
Universita di Napoli - Parthenope, Napoli, Italy
A. Nehorai
Washington University, St. Louis, MO, USA
S.J. Perantonis
Nat. Center for Scientific Research Demokritos, Agia Paraskevi, Greece
B.P. Pesquet-Popescu
Ecole Nationale Supérieure des Télécommuncations (ENST), Paris, France
G. Poggi
Università di Napoli Federico II, Napoli, Italy
P.A. Regalia
Catholic University of America, Washington, DC, USA
B.M. Sadler
U.S. Army Research Laboratory, Adelphi, MD, USA
H. Sakai
Kyoto University, Kyoto, Japan
B. Sankur
Bogazici University, Bebek, Turkey
A.H. Sayed
University of California at Los Angeles (UCLA), Los Angeles, CA, USA
E. Serpedin
Texas A & M University, TX, USA
P. Shi
University of Glamorgan, Pontipridd, UK
N. Sidiropoulos
Technical University of Crete, Chania, Crete, Greece
T. Sikora
Technische Universität Berlin (TUB), Berlin, Germany
D.T.M. Slock
Institut EURECOM, Sophia Antipolis Cedex, France
P. Stoica
Uppsala Universitet, Uppsala, Sweden
S. Sung
Seoul National University, Gwanag-Gu, Seoul, South Korea
I. Tabus
Tampere University of Technology, Tampere, Finland
C.-C. Tseng
National Kaohsiung First University of Science and Technology, Nantz District, Kaohsiung, Taiwan
L. Wang
University of Melbourne, Parkville, VIC, Australia
A.J. Weiss
Tel Aviv University, Tel Aviv, Israel
S. Werner
Helsinki University of Technology (TKK), Finland
X.-G. Xia
University of Delaware, Newark, DE, USA
H.Y. Yu
Virginia Polytechnic Institute and State University, Blacksburg, USA
Y. Zhang
Villanova University, Villanova, PA, USA
A.M. Zoubir
 
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