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Signal Processing

An International Journal

Signal Processing
ISSN: 0165-1684
Imprint: ELSEVIER
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Statistics
Impact Factor: 1.256
5-Year Impact Factor: 1.319
Issues per year: 12

Editorial Board



Editor-in-Chief

B. Ottersten
Royal Institute of Technology (KTH), Stockholm, Sweden, Email: Bjorn.Ottersten@ee.kth.se

Editorial Board

P. Abry
École Normale Supérieure de Lyon, Lyon Cedex 07, France
A.K. Barros
Universidade Federal do Maranhao, Sao Luis, Brazil
T. Blu
Chinese University of Hong Kong, Shatin, New Territories, Hong Kong
H. Boche
Fraunhofer Institut für Nachrichtentechnik, Berlin, Germany
G. Bozdagi Akar
Middle East Technical University (METU), Ankara, Turkey
T.D. Bui
Concordia University, Montréal, QC, Canada
A. Carini
Università degli Studi de Urbino, Urbino, Italy
R. Chellappa
University of Maryland, College Park, MD, USA
S. Chen
University of Southampton, Southampton, UK
N.I. Cho
Seoul National University, Seoul, South Korea
P. Comon
Universite de Nice-Sophia Antipolis, Sophia-Antipolis Cedex, France
P.L. Correia
Universidade Técnica de Lisboa, São João De Deus, Lisboa, Portugal
T-B. Deng
Toho University, Chiba, Japan
Z. Ding
University of Pittsburgh, Davis, CA, USA
K. Dogancay
University of South Australia, Adelaide, SA, Australia
Y. Eldar
Technion - Israel Institute of Technology, Haifa, Israel
J.R. Fonollosa
Universitat Politecnica de Catalunya (UPC), Barcelona, Spain
X. Gao
Xidian University, Xi'an, China
A.B. Gershman
Technische Universität Darmstadt, Darmstadt, Germany
G.B. Giannakis
University of Minnesota, Minneapolis, USA
F. Gini
Università di Pisa, Pisa, Italy
B. Guoan
Nanyang Technological University, Singapore, Singapore
A. Hanssen
University of Tromsø, Tromsø, Norway
X. He
Zhejiang University, Hangzhou, China
U. Heute
Christian-Albrechts-Universität zu Kiel (CAU), KIEL, Germany
Y. Hua
University of California at Riverside, Riverside, CA, USA
M. Jansen
Katholieke Universiteit Leuven, Leuven, Belgium
S.H. Jensen
Aalborg University, Aalborg, FO, Denmark
M. Jiang
Peking University, Beijing, China
M. Kieffer
SUPELEC Ecole Superieure D'Electricite - Univ. Paris Sud, Gif-sur-Yvette Cedex, France
B. Kleijn
Royal Institute of Technology (KTH), Stockholm, Sweden
V. Koivunen
Helsinki University of Technology (TKK), HUT, Finland
P. Loubaton
Université de Marne-la-Vallée, Marne La Vallee, France
G. Matz
Technische Universität Wien, Wien, Austria
M. Mihaylova
Lancaster University, Lancaster, England, UK
M. Moonen
Katholieke Universiteit Leuven, Heverlee, Belgium
A. Napolitano
Università di Napoli "Parthenope", Napoli, Italy
A. Nehorai
Washington University, St. Louis, MO, USA
S.J. Perantonis
Nat. Center for Scientific Research Demokritos, Agia Paraskevi, Greece
G. Poggi
Università di Napoli Federico II, Napoli, Italy
P.A. Regalia
Catholic University of America, Washington, DC, USA
C. Richard
Universite de Nice-Sophia Antipolis, Nice Cedex 02, France
B.M. Sadler
U.S. Army Research Laboratory, Adelphi, MD, USA
H. Sakai
Kyoto University, Kyoto, Japan
A.H. Sayed
University of California at Los Angeles (UCLA), Los Angeles, CA, USA
E. Serpedin
Texas A&M University, TX, USA
P. Shi
University of Glamorgan, Pontipridd, UK
N. Sidiropoulos
Technical University of Crete, Crete, Greece
P. Stoica
Uppsala Universitet, Uppsala, Sweden
S. Sung
Seoul National University, Gwanag-Gu, Seoul, South Korea
D. Tao
Nanyang Technological University, Singapore, Singapore
C.-C. Tseng
National Kaohsiung First University of Science and Technology, Nantz District, Kaohsiung, Taiwan, ROC
L. Wang
University of Melbourne, Parkville, VIC, Australia
S. Werner
Helsinki University of Technology (TKK), HUT, Finland
X.-G. Xia
University of Delaware, Newark, DE, USA
H.Y. Yu
Virginia Polytechnic Institute and State University, Blacksburg, USA
Y. Zhang
Villanova University, Villanova, PA, USA
A.M. Zoubir
Technische Universität Darmstadt, Darmstadt, Germany
 
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