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Thin Solid Films

International Journal on the Science and Technology of Condensed Matter Films

Thin Solid Films
ISSN: 0040-6090
Imprint: ELSEVIER
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Statistics
Impact Factor: 1.884
5-Year Impact Factor: 1.942
Issues per year: 24

Editorial Board



Editor-in-Chief:

J.E. Greene
Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 104 S. Goodwin Avenue, Urbana, IL 61801, USA, E-mail: tsf@polymtl.ca

Associate Editor:

P. Desjardins
Dépt de Génie Physique, Ecole Polytechnique de Montreal, C.P. 6079; Succ. Centre Ville, Montréal, H3C 3A7, Canada. E-mail: tsf@polymtl.ca

Editorial Board:

T.L. Alford
Tempe, AZ, USA
D.E. Aspnes
Raleigh, NC, USA
J.-M. Baribeau
Ottawa, ON, Canada
P.B. Barna
Budapest, Hungary
D. Gall
Troy, NY, USA
S. Hofmann
Stuttgart, Germany
H.J. Kim
Pohang, South Korea
M. Kitabatake
Kyoto, Japan
A.E.T. Kuiper
Eindhoven, Netherlands
E. Kusano
Hakusan, Japan
A. Lopez-Otero
Stanford, CA, USA
P.J. Martin
Lindfield, NSW, Australia
S. Nakahara
Limerick, Ireland
A.K. Pal
Jadavpur, Kolkata, India
J. Patscheider
Dübendorf, Switzerland
J-J. Pireaux
Namur, Belgium
D. Poitras
Ottawa, ON, Canada
L. Reven
J.R. Sambles
Exeter, UK
I.K. Schuller
La Jolla, CA, USA
J.A.N.T. Soares
Urbana, IL, USA
P. Sofronis
Urbana, USA
M. Sugi
R.H. Tredgold
Lancaster, UK
W.D. Westwood
Nepean, ON, Canada
 
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