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International Journal of Solids and Structures

International Journal of Solids and Structures
ISSN: 0020-7683
Imprint: ELSEVIER

Statistics
Impact Factor: 1.809
5-Year Impact Factor: 2.175
Issues per year: 26

Editorial Board



Associate Editor

D.A. Hills
Dept. of Engineering Science, University of Oxford, Parks Road, Oxford, OX1 3PJ, UK, Tel: (+44 1865) 2 73119, Email: david.hills@eng.ox.ac.uk
S. Kyriakides
Dept. of Aerospace Engineering & Engineering Mechanics, University of Texas at Austin, 1 University Station C2100, Austin, TX 78712-0284, USA, Fax: +1 512 471 5500, Tel: +1 512 471 5963, Email: skk@mail.utexas.edu

Assistant Editor

D. Dini
Imperial College, London, UK

Board of Editors

R. Abeyaratne
Massachusetts Institute of Technology, Cambridge, MA, USA
R. Becker
Lawrence Livermore National Laboratory, Livermore, CA, USA
T. Belytschko
Northwestern University, Evanston, IL, USA
J. Benson
University of California at Los Angeles (UCLA), Los Angeles, CA, USA
H. Chai
Tel Aviv University, Ramat Aviv, Israel
A. Combescure
INSA de Lyon, Villeurbanne, France
N. A. Fleck
University of Cambridge, Cambridge, UK
H. Gao
Brown University, Providence, RI, USA
H. Jensen
University of Aarhus, Århus C, Denmark
M. Liechti
University of Texas at Austin, Austin, TX, USA
R. McMeeking
University of California, Santa Barbara, CA, USA
S. Natsiavas
Aristotle University of Thessaloniki, Thessaloniki, Greece
K. W. Neale
Université de Sherbrooke, Sherbrooke, QC, Canada
N. O'Dowd
University of Limerick, Limerick, Ireland
H. Obrecht
Technische Universität Dortmund, Dortmund, Germany
N. Ohno
Nagoya University, Nagoya, Japan
P. Steinmann
Friedrich-Alexander-Universität Erlangen-Nürnberg, Erlangen, Germany
N. Stephen
University of Southampton, Highfield, Southampton, UK
Z. Suo
Harvard University, Cambridge, USA
P. Suquet
Lab de Mecanique et D'Acoustiq, Marseille, France
Y. Tomita
Kobe University, Nada, Japan
N. Triantafyllidis
University of Michigan, Ann Arbor, MI, USA
J. Van Mier
Institute for Building Materials, Zurich, Switzerland
T.X. Yu
Hong Kong University of Science & Technology, Kowloon, Hong Kong
Q. Zheng
Tsinghua University, Beijing, China
 
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