Materials Science in Semiconductor Processing provides a unique and much needed forum for the discussion
of experimental and theoretical materials research stimulated by and applied to semiconductor processing.
Each issue will aim to
provide a snapshot of current comprehension, new achievements, breakthroughs and future trends in ... click here for full Aims & Scope
Materials Science in Semiconductor Processing provides a unique and much needed forum for the discussion
of experimental and theoretical materials research stimulated by and applied to semiconductor processing.
Each issue will aim to
provide a snapshot of current comprehension, new achievements, breakthroughs and future trends in such fields as ion implantation, diffusion
and gettering, process and equipment modelling, metallization and interconnects, packaging, etc, which are the backbone of semiconductor
device processing.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation
for dopant engineering; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; ultra low energy implantation:
physics, limitations and perspectives; gettering procedures for ULSI; advanced metallization and interconnects schemes; thin dielectric
layer, oxidation; cleaning procedures for ULSI devices; compound semiconductor processing; physical modelling of processing (ion implantation,
metal deposition, oxidation, etching, etc.): molecular dynamics, ab-initio methods, Monte Carlo, etc.; new physical models in commercial
simulation platforms for the design and modelling of advanced devices; equipment modelling; new materials and processes for discrete
and integrated circuits; heterostructures and quantum devices; engineering of the electrical and optical the properties of semiconductors;
crystal growth: mechanisms, reliability, defect density intrinsic impurities and defects.
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Editor
S. Zaima
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