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 An International Journal of Semiconductor Manufacturing Technology including Nanoelectronic Engineering
Editor-in-Chief, Europe:
M. Van Rossum
See editorial board for all editors information
Proceedings MNE 2006
Proceedings MNE 2005
Proceedings MNE 2004
Now Available
Submit your paper online via the
Microelectronic Engineering Online Submission Tool
Feedback
We are always interested in receiving suggestions on the journal. Also, if you have publication proposals for books or new journals in the field or suggestions for any other kind of cooperation, please do not hesitate to contact us. Monique Lamine, Publishing Editor, E-mail: m.lamine@elsevier.com.
Description
The aim of Microelectronic Engineering is to bring together in one publication the results of international
work in the rapidly expanding field of integrated microelectronics.
Microelectronic Engineering is an archival, peer-reviewed
journal. It publishes full research papers, accelerated publications (letters), short notes and review articles.
The journal is dedicated
to advanced engineering methods for micro- and nanofabrication of electronic devices, circuits and systems for electronics, electromechanics,
and bioelectronics.
This includes following topics:
1. Nanolithography and Nanopatterning
•optical lithography
•EUV lithography and masks
•charged particle based lithography and patterning
•nanoimprint lithography techniques
and templates
•maskless lithography
•emerging nanopatterning methods
•limits of nanolithography and nanopatterning
2. Pattern Transfer
•ion technology
•plasma processing: etching, nanotexturing, bonding
3. Materials
•metallization and barrier materials
•silicon on insulators
•dielectrics (low K and high K)
•interconnects
•new resist materials
•nanomaterials for device fabrication
•block copolymers
•polymers and flexible
substrates
4. Nanometrology, Inspection and Testing
•electron beam testers
•laser probes
•signal
and image processing
•nanometrology
•AFM, Scanning probe measurements
5. Advanced Processing and Nanofabrication
•process integration
•three dimensional integration
•rapid thermal processing
•process modelling and
simulation
•equipment modelling
•laser assisted processing
•top-down / bottom-up (self - assembly) nanofabrication
6. Advanced Devices
•nanometer devices for electronics and optoelectronics
•dimension-sensitive device properties
•advanced MOS devices
•vacuum nanoelectronics
•organic and molecular electronics
•mesoscopic devices
•micro- & nanofluidics
•other miniaturized devices for biology, chemistry, medicine
7. Advanced fabrication
and characterization for heterogeneous micro- and nanosystems
•electro-mechanical systems (MEMS, NEMS)
•optical
systems
•fluidic systems
•biosystems
•lab-on-a-chip
Bibliographic & ordering information
ISSN: 0167-9317
Imprint: ELSEVIER
Commenced publication 1983
Subscriptions for the year 2008,
Volume 85,
12 issues
Institutional online access: ScienceDirect eSelect
For purchase of online access to this journal on ScienceDirect.
Institutional price: Order form
USD 2,456 for all countries except Europe, Japan and Iran
JPY 291,700 for Japan
EUR 2,193 for European countries and Iran
Conditions of sale & ordering procedures, and links to our regional sales offices.
For an overview of recently-dispatched issues, see the Journal issue
dispatch dates
Audience
Scientists and engineers in industry and academia involved in micro and nanoelectronics.
Impact factor of this journal
2006: 1.398
Journal Citation Reports® 2007, published by Thomson Scientific
600/153
Last update: 12 May 2008
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