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MICROELECTRONIC ENGINEERING
Microelectronic EngineeringAn International Journal of Semiconductor Manufacturing Technology including Nanoelectronic Engineering

Editor-in-Chief, Europe:
M. Van Rossum
See editorial board for all editors information





Proceedings MNE 2006

Proceedings MNE 2005

Proceedings MNE 2004

Now Available
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Microelectronic Engineering Online Submission Tool

Feedback
We are always interested in receiving suggestions on the journal. Also, if you have publication proposals for books or new journals in the field or suggestions for any other kind of cooperation, please do not hesitate to contact us. Monique Lamine, Publishing Editor, E-mail: m.lamine@elsevier.com.

Description


The aim of Microelectronic Engineering is to bring together in one publication the results of international work in the rapidly expanding field of integrated microelectronics.

Microelectronic Engineering is an archival, peer-reviewed journal. It publishes full research papers, accelerated publications (letters), short notes and review articles.

The journal is dedicated to advanced engineering methods for micro- and nanofabrication of electronic devices, circuits and systems for electronics, electromechanics, and bioelectronics.
This includes following topics:

1. Nanolithography and Nanopatterning
•optical lithography
•EUV lithography and masks
•charged particle based lithography and patterning
•nanoimprint lithography techniques and templates
•maskless lithography
•emerging nanopatterning methods
•limits of nanolithography and nanopatterning

2. Pattern Transfer
•ion technology
•plasma processing: etching, nanotexturing, bonding

3. Materials
•metallization and barrier materials
•silicon on insulators
•dielectrics (low K and high K)
•interconnects
•new resist materials
•nanomaterials for device fabrication
•block copolymers
•polymers and flexible substrates

4. Nanometrology, Inspection and Testing
•electron beam testers
•laser probes
•signal and image processing
•nanometrology
•AFM, Scanning probe measurements

5. Advanced Processing and Nanofabrication
•process integration
•three dimensional integration
•rapid thermal processing
•process modelling and simulation
•equipment modelling
•laser assisted processing
•top-down / bottom-up (self - assembly) nanofabrication

6. Advanced Devices
•nanometer devices for electronics and optoelectronics
•dimension-sensitive device properties
•advanced MOS devices
•vacuum nanoelectronics
•organic and molecular electronics
•mesoscopic devices
•micro- & nanofluidics
•other miniaturized devices for biology, chemistry, medicine

7. Advanced fabrication and characterization for heterogeneous micro- and nanosystems
•electro-mechanical systems (MEMS, NEMS)
•optical systems
•fluidic systems
•biosystems
•lab-on-a-chip

Bibliographic & ordering information
ISSN: 0167-9317
Imprint: ELSEVIER
Commenced publication 1983

Subscriptions for the year 2008, Volume 85, 12 issues

Institutional online access: ScienceDirect eSelect
For purchase of online access to this journal on ScienceDirect.

Institutional price: Order form
USD 2,456 for all countries except Europe, Japan and Iran
JPY 291,700 for Japan
EUR 2,193 for European countries and Iran


Conditions of sale & ordering procedures, and links to our regional sales offices.

For an overview of recently-dispatched issues, see the Journal issue dispatch dates

Audience
Scientists and engineers in industry and academia involved in micro and nanoelectronics.

Impact factor of this journal
2006: 1.398
Journal Citation Reports® 2007, published by Thomson Scientific



600/153
Last update: 12 May 2008
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