HANDBOOK OF PHYSICAL VAPOR DEPOSITION (PVD) PROCESSING
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By Donald M. Mattox, Society of Vacuum Coaters (Technical Director)
Description This book covers all aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate
material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the book is on the
aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications.
The book covers subjects seldom treated in the literature: substrate characterization, adhesion, cleaning and the processing. The book
also covers the widely discussed subjects of vacuum technology and the fundamentals of individual deposition processes. However, the
author uniquely relates these topics to the practical issues that arise in PVD processing, such as contamination control and film growth
effects, which are also rarely discussed in the literature. In bringing these subjects together in one book, the reader can understand
the interrelationship between various aspects of the film deposition processing and the resulting film properties. The author draws upon
his long experience with developing PVD processes and troubleshooting the processes in the manufacturing environment, to provide useful
hints for not only avoiding problems, but also for solving problems when they arise. He uses actual experiences, called ""war stories"",
to emphasize certain points. Special formatting of the text allows a reader who is already knowledgeable in the subject to scan through
a section and find discussions that are of particular interest. The author has tried to make the subject index as useful as possible
so that the reader can rapidly go to sections of particular interest. Extensive references allow the reader to pursue subjects in greater
detail if desired.
The book is intended to be both an introduction for those who are new to the field and a valuable resource to those
already in the field. The discussion of transferring technology between R&D and manufacturing provided in Appendix 1, will be of special
interest to the manager or engineer responsible for moving a PVD product and process from R&D into production. Appendix 2 has an extensive
listing of periodical publications and professional societies that relate to PVD processing. The extensive Glossary of Terms and Acronyms
provided in Appendix 3 will be of particular use to students and to those not fully conversant with the terminology of PVD processing
or with the English language.
Audience
Engineers, including surface engineering personnel, technicians, and other plant personnel in process industries such as semiconductors
and microelectronics. Especially informative for those new to the field.
Contents 1. Introduction
1.1 Surface Engineering
1.2 Thin Film Processing
1.3 Process Documentation
1.4 Safety and Environmental Concerns
1.5 Units
1.6 Summary
2. Substrate (""Real"") Surfaces and Surface Modification
2.1 Introduction
2.2 Materials and Fabrication
2.3 Atomic Structure and Atom-Particle Interactions
2.4 Characterization of Surfaces and Near-Surface Regions
2.5 Bulk Properties
2.6 Modification of Substrate Surfaces
2.7 Summary
3. The Low-Pressure Gas and Vacuum Processing Environment
3.1 Introduction
3.2 Gases and Vapors
3.3 Gas-Surface Interactions
3.4 Vacuum Environment
3.5 Vacuum Processing Systems
3.6 Vacuum Pumping
3.7 Vacuum and Plasma Compatible Materials
3.8 Assembly
3.9 Evaluating Vacuum System Performance
3.10 Purchasing a Vacuum System
for PVD Processing
3.11 Cleaning of Vacuum Surfaces
3.12 System-Related Contamination
3.13 Process-Related Contamination
3.14
Treatment of Specific Materials
3.15 Safety Aspects of Vacuum Technology
3.16 Summary
4. The Low-Pressure Plasma Processing Environment
4.1 Introduction
4.2 The Plasma
4.3 Plasma-Surface Interactions
4.4 Configurations for Generating Plasmas
4.5 Ion and Plasma
Sources
4.6 Plasma Processing Systems
4.7 Plasma-Related Contamination
4.8 Some Safety Aspects of Plasma Processing
4.9 Summary
5. Vacuum Evaporation and Vacuum Deposition
5.1 Introduction
5.2 Thermal Vaporization
5.3 Thermal Vaporization Sources
5.4 Transport
of Vaporized Material
5.5 Condensation of Vaporized Material
5.6 Materials for Evaporation
5.7 Vacuum Deposition Configurations
5.8 Process Monitoring and Control
5.9 Contamination from the Vaporization Source
5.10 Advantages and Disadvantages of Vacuum Deposition
5.11 Some Applications of Vacuum Deposition
5.12 Gas Evaporation and Ultrafine Particles
5.13 Other Processes
5.14 Summary
6.
Physical Sputtering and Sputter Deposition (Sputtering)
6.1 Introduction
6.2 Physical Sputtering
6.3 Sputtering Configurations
6.4 Transport of the Sputter-Vaporized Species
6.5 Condensation of the Sputtered Species
6.6 Sputter Deposition Geometrics
6.7
Targets and Target Materials
6.8 Process Monitoring and Control
6.9 Contamination Due to Sputtering
6.10 Advantages and Disadvantages
of Sputter Deposition
6.11 Some Applications of Sputter Deposition
6.12 Summary
7. Arc Vapor Deposition
7.1 Introduction
7.2 Arcs
7.3 Arc Source Configurations
7.4 Reactive Arc Deposition
7.5 Arc Materials
7.6 Arc Vapor Deposition System
7.7 Process
Monitoring and Control
7.8 Contamination Due to Arc Vaporization
7.9 Advantages and Disadvantages of Arc Vapor Deposition
7.10
Some Applications of Arc Vapor Deposition
7.11 Summary
8. Ion Plating and Ion Beam Assisted Deposition
8.1 Introduction
8.2 Stages
of Ion Plating
8.3 Sources of Depositing and Reacting Species
8.4 Sources of Energetic Bombarding Species
8.5 Sources of Accelerating
Potential
8.6 Some Plasma-Based Ion Plating Configurations
8.7 Ion Beam Assisted Deposition (IBAD)
8.8 Process Monitoring and Control
8.9 Contamination on the Ion Plating Process
8.10 Advantages and Disadvantages of Ion Plating
8.11 Some Applications of Ion Plating
8.12 A Note on Ionized Cluster Beam (ICB) Deposition
8.13 Summary
9. Atomistic Film Growth and Some Growth-Related Film Properties
9.1 Introduction
9.2 Condensation and Nucleation
9.3 Interface Formation
9.4 Film Growth
9.5 Reactive and Quasi-Reactive Deposition
of Films of Compounded Materials
9.6 Post Deposition Processing and Changes
9.7 Deposition of Unique Materials and Structures
9.8
Summary
10. Film Characterization and Some Basic Film Properties
10.1 Introduction
10.2 Objectives of Characterization
10.3
Types of Characterization
10.4 Stages and Degree of Characterization
10.5 Some Film Properties
10.6 Summary
11. Adhesion and Deadhesion
11.1 Introduction
11.2 Origin of Adhesion and Adhesion Failure (Deadhesion)
11.3 Adhesion of Atomistically Deposited Inorganic
Films
11.4 Adhesion Failure (Deadhesion)
11.5 Adhesion Testing
11.6 Designing for Good Adhesion
11.7 Failure Analysis
11.8
Summary
12. Cleaning
12.1 Introduction
12.2 Gross Cleaning
12.3 Specific Cleaning
12.4 Application of Fluids
12.5 Removal of
Particulate Contamination
12.6 Rinsing
12.7 Drying, Outgassing, and Outdiffusion
12.8 Cleaning Lines
12.9 Handling and Storage/Transportation
12.10 Evaluation and Monitoring of Cleaning
12.11 In Situ Cleaning
12.12 Contamination of the Film Surface
12.13 Safety
12.14
Summary
13. External Processing Environment
13.1 Introduction
13.2 Reduction of Contamination
13.3 Materials
13.4 Body Coverings
13.5 Processing Areas
13.6 Summary
APPENDIX 1: Reference Material
APPENDIX 2: Transfer of Technology from R&D to Manufacturing
Glossary of Terms and Acronyms Used in Surface Engineering
Bibliographic details
Hardbound, 944 pages, publication date: DEC-1998
ISBN-13: 978-0-8155-1422-0
ISBN-10: 0-8155-1422-0
Imprint: WILLIAM ANDREW
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