By
Ioan D. Marinescu, University of Toledo, OH, USA
W. Brian Rowe, Advanced Manufacturing Technology and Tribology Research Laboratory (AMTTREL) at Liverpool John Moores University, UK
Boris Dimitrov, Institute for Applied Mechanics and the Institute for Precision Mechanics in Bucharest Romania
Ichiro Inaski
Description
Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining
processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing,
this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process
efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood
as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in
accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens
to semiconductors.
Audience:
Machining process engineers, technicians, researchers and students.
