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| ENCAPSULATION TECHNOLOGIES FOR ELECTRONIC APPLICATIONS
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To order this title, and for more information, click here
By
Haleh Ardebili, Department of Mechanical Engineering, University of Houston, USA She is also a visiting scholar at Rice University in the Mechanical Engineering and Materials Science Department.
Michael Pecht, CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA
Included in series
Materials and Processes for Electronic Applications,
Description
Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace.
They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes.
Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead
to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments,
as well as to provide handling, assembly, electrical and thermal considerations.
Currently, more than 99% of microelectronic devices
are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic
electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf
(COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability.
With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated
additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging
and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical
systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs).
This book offers a comprehensive discussion of
encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation
of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials
including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book
provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how
to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and
challenges of encapsulation and microelectronic packages including application of nanotechnology.
Audience
Electronics and micro-electronics industry professionals, semiconductor chip and wafer designers, anyone interested in electronic packaging.
| Bibliographic details |
Hardbound, 504 pages, publication date: JUN-2009
ISBN-13: 978-0-8155-1576-0
Imprint: WILLIAM ANDREW
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| Price and Ordering |
Price:
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USD 195
EUR 138.95
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Last update: 25 Sep 2009
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