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| HANDBOOK OF SILICON BASED MEMS MATERIALS & TECHNOLOGIES
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By
Veikko Lindroos
Markku Tilli
Ari Lehto
Teruaki Motooka
Included in series
Micro and Nano Technologies,
Description
A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis
on current and future applications.
Key topics covered include:
- Silicon as MEMS material
- Material properties and measurement techniques
- Analytical methods used in materials characterization
- Modeling in
MEMS
- Measuring MEMS
- Micromachining technologies in MEMS
- Encapsulation of MEMS components
- Emerging
process technologies, including ALD and porous silicon
Written by 73 world class MEMS contributors from
around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling
the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive
reference for the industrial R&D and academic communities.
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Veikko Lindroos is Professor of Physical Metallurgy
and Materials Science at Helsinki University of Technology, Finland.
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Markku Tilli is Senior Vice President of Research
at Okmetic, Vantaa, Finland.
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Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland.
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Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan.
Audience
Engineers, researchers and scientists in sensor manufacturing.
Contents
PART I: Silicon as MEMS Material
Edited by Markku Tilli
1. Properties of silicon
2. CZ Growth of silicon crystals
3. Properties
of silicon crystals
4. Oxygen in Silicon
5. Silicon wafers; preparation and properties
6. Epi wafers; preparation and properties
7.
Thick-Film SOI wafers; preparation and properties
8. Silicon dioxides
PART II: Modeling in MEMS
Edited by Teruaki Motooka
and Risto Nieminen
9. Multiscale modeling methods
10. Manufacture and processing of MEMS structures
11. Mechanical properties
of silicon microstructures
12. Electrostatic and RF properties of MEMS structures
13. Optical Modelling of MEMS
14. Gas
Damping in Vibrating MEMS structures
PART III: Measuring MEMS
Edited by Veli-Matti Airaksinen
15. Introduction to Measuring
MEMS
16. Silicon wafer and thin film measurements
17. Optical measurement of static and dynamic displacement
18. MEMS residual
stress characterization, methodology and perspective
19. Strength of bonded interfaces
20. Focused ion and electron beam techniques
21.Oxygen
and Bulk Microdefects in Silicon
PART IV: Micromachining Technologies in MEMS
Edited by Helmut Seidel
22. MEMS
litography
23. Deep reactive ion etching (DRIE)
24. Wet etching of silicon
25. Porous silicon based MEMS
26. Atomic layer
deposition in MEMS technology
27. Metallic glass
29. Surface micromachining
29. Silicon based bioMEMS micromachining technologies
PART
V: Encapsulation of MEMS Components
Edited by Heikki Kuisma and Ari Lehto
30. Introduction to encapsulation of MEMS devices
31.
Silicon direct bonding
32. Anodic bonding
33. Glass frit bonding
34. Metallic alloy seal bonding
35. Bonding CMOS processed
wafers
36. Non-Destructive Bond Strength Testing of Anodic Bonded Wafers
37. Wafer Bonding Equipment
38. Encapsulation by Film
Deposition
39. Via Technologies for MEMS
40. Outgassing and Gettering
41. Dicing of MEMS devices
42. Hermecity Tests
| Bibliographic details |
Hardbound, 0 pages, publication date: JAN-2010
ISBN-13: 978-0-8155-1594-4
Imprint: WILLIAM ANDREW
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Price:
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GBP 147.99
EUR 174.95
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Last update: 19 Nov 2009
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