By
Vasilis Pavlidis
Eby Friedman
Description
With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing
the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance
among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance.
Three-dimensional
(3D) integrated circuits (ICs), which contain multiple layers of active devices, have the potential to enhance dramatically chip performance
and functionality, while reducing the distance among devices on a chip. They promise solutions to the current "interconnect bottleneck"
challenges faced by IC designers. They also may facilitate the integration of heterogeneous materials, devices, and signals. However,
before these advantages can be realized, key technology challenges of 3D ICs must be addressed.
This is the first book on 3-D
integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective
solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. A handy, comprehensive reference
or a practical design guide, this book provides a sound foundation for the design of three-dimensional integrated circuits.
Audience:
VLSI design engineers, CAD Designers of Microprocessors and Systems-on-Chip (SOC), concerned with 3-D integration in chip design...INTERCONNECT,
at companies globally such as Microsoft, Honeywell, Intel, AMD, IBM, HP, NVIDIA, Marvell, Texas Instruments, Samsung, Hitachi, Sony,
Fujitsu, Toshiba, ST Microelectronics, NXP, Freescale, Infineon, NOKIA, Qualcom, Cadence, Synopsys, Magma, Mentor Graphics, Tezzaron
Inc, Ziptronix,Tru-Si, IMEC Belgium, etc.
