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ADVANCES IN RESEARCH AND DEVELOPMENT: PLASMA SOURCES FOR THIN FILM DEPOSITION AND ETCHING, 18
Advances in Research and Development: Plasma Sources for Thin Film Deposition and Etching, 18

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Maurice Francombe, Georgia State University, Atlanta, U.S.A.
John Vossen, RCA Laboratories, Princeton, New Jersey

Description
This latest volume of the well-known Physics of Thin Films Series includes four chapters that discuss high-density plasma sources for materials processing, electron cyclotron resonance and its uses, unbalancedmagnetron sputtering, and particle formation in thin film processing plasma.

Audience
Libraries, researchers in electrical engineering, condensed matter physics, and materials science departments. All academic and industrial thin film researchers.

Contents
M.A. Lieberman and R.A. Gottscho, Design of High- Density Plasma Sources for Materials Processing. O.A. Popov, Electron Cyclotron Resonance Plasma Sources and Their Use in Plasma-Assisted Chemical Vapor Deposition of Thin Films. S.L. Rohde, Unbalanced Magnetron Sputtering. C. Steinbruchel, The Formation of Particles in Thin-Film Processing Plasmas. References. Author Index. Subject Index.

Bibliographic details
Hardbound, 328 pages, publication date: AUG-1994
ISBN-13: 978-0-12-533018-3
ISBN-10: 0-12-533018-9
Imprint: ACADEMIC PRESS

Price and Ordering
Price:
GBP 130.99
USD 216
EUR 153.95
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Last update: 3 Oct 2009
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