 |
|
| WI-FI TELEPHONY
| |
| | |
|
|
Challenges and Solutions for Voice over WLANs
To order this title, and for more information, click here
By
Praphul Chandra, Texas Instruments, Germantown, MD, USA
David Lide, Texas Instruments, Germantown, MD, USA
Description
Wi-Fi telephony is the latest, most cost effective, and clearest way of carrying voice data wirelessly. The great news is that it can
be integrated seamlessly into the same infrastructures as currently used for computer and telephone data.The digital quality is far above
current cellular technologies.
This book will be among the first to discuss Session Initiation Protocol (SIP), Quality of Service (QoS),
and interoperability in connection with Wi-Fi telephony. Security challenges are also presented and solved along these malleable wireless
boundaries. In short, this book provides all the information necessary for effective, reliable, crystal clear Wi-Fi telephony service
and implementation.
Audience
RF/wireless engineers and designers, computer/data network engineers; engineering managers, graduate students
Contents
Chapter 1: The Basics
Chapter 2: The Data World
Chapter 3: Voice over IP
Chapter 4: Wireless Local Area Networks
Chapter 5: VoWLAN
Challenges
Chapter 6: QoS & System Capacity
Chapter 7: Security
Chapter 8: Roaming
Chapter 9: Power Management
Chapter 10: Voice
over WiFi and other Wireless
Technologies
| Bibliographic details |
Paperback, 288 pages, publication date: OCT-2006
ISBN-13: 978-0-7506-7971-8
ISBN-10: 0-7506-7971-9
Imprint: NEWNES
|
| Price and Ordering |
Price:
EUR 43.95
USD 57.95
GBP 37
|  |
Books and book related electronic products are priced in US dollars (USD), euro (EUR), and Great Britain Pounds (GBP). USD prices apply to the Americas and Asia Pacific. EUR prices apply in Europe and the Middle East. GBP prices apply to the UK and all other countries.
|
See also information about conditions of sale & ordering procedures, and links to our regional sales offices.
|
032/320
Last update: 5 Sep 2009
|
|
| |
| | |
|
|
| |
Home | Elsevier Sites | Privacy Policy | Terms and Conditions | Feedback | Site Map | A Reed Elsevier Company