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Materials Science in Semiconductor Processing

  • ISSN: 1369-8001

Next planned ship date: May 2, 2024

  • 5 Year impact factor: 3.7
  • Impact factor: 4.1

Functional Materials for (Opto)electronics, Sensors, Detectors, and Green Energy. Materials Science in Semiconductor Processing Mrovides a unique forum for the discussion of novel… Read more

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Next planned ship date:
May 2, 2024

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Functional Materials for (Opto)electronics, Sensors, Detectors, and Green Energy.

Materials Science in Semiconductor Processing Mrovides a unique forum for the discussion of novel processing, applications, and theoretical studies of functional semiconductor materials and devices. Each issue aims to provide a snapshot of current insights, new achievements, breakthroughs, perspectives, and future trends in material sciences for such diverse fields as advanced electronics and opto-electronics, sensors and detectors, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film deposition and growth technology, hybrid and quantum materials, device fabrication technology, and modelling, which are the backbone of advanced semiconductor processing and applications.


Coverage will include: advanced lithography, etching, doping, annealing, and thin film processing for submicron and nano devices; material and device failure, reliability, damage evolution, and related issues; advanced chemical and physical vapor deposition; advanced metallization and interconnect schemes; compound semiconductor materials and processing; new dielectrics and non-oxide materials and their applications; (macro)molecular, hybrid, heterostructure, and quantum materials, devices, and processing; molecular dynamics, ab-initio methods, Monte Carlo simulations, data intensive and machine-learning based approaches, etc.; new materials and processes for discrete and integrated circuits; advanced electronic packaging materials and processes; magnetic materials and spintronics; crystal growth technology and mechanism; intrinsic impurities and defects of materials. Pure device simulation and modelling without connection to experiment is not within the aim and scope of this journal.

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