Microelectronics Journal

Microelectronics Journal - ISSN 0026-2692
Source Normalized Impact per Paper (SNIP): 0.839 Source Normalized Impact per Paper (SNIP):
SNIP measures contextual citation impact by weighting citations based on the total number of citations in a subject field.
SCImago Journal Rank (SJR): 0.362 SCImago Journal Rank (SJR):
SJR is a prestige metric based on the idea that not all citations are the same. SJR uses a similar algorithm as the Google page rank; it provides a quantitative and a qualitative measure of the journal’s impact.
Impact Factor: 0.876 (2015) Impact Factor:
The Impact Factor measures the average number of citations received in a particular year by papers published in the journal during the two preceding years.
© Thomson Reuters Journal Citation Reports 2015
5 Year Impact Factor: 0.92 (2015) Five-Year Impact Factor:
To calculate the five year Impact Factor, citations are counted in 2014 to the previous five years and divided by the source items published in the previous five years.
© Journal Citation Reports 2015, Published by Thomson Reuters
Volumes: Volumes 59-70
Issues: 12 issues
ISSN: 00262692

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Description

Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.

The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to

• Analog, digital, mixed, and RF circuits and related design methodologies

• Logic, architectural, and system level synthesis

• Testing, design for testability, built-in self-test

• Area, power, and thermal analysis and design

• Mixed-domain simulation and design

• Embedded systems

• Non-von Neumann computing and related technologies and circuits

• Design and test of high complexity systems integration

• SoC, NoC, SIP, and NIP design and test

• 3-D integration design and analysis

• Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.

Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.

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