VLSI Electronics

VLSI Electronics

Microstructure Science

1st Edition - September 28, 1982

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  • Editor: Norman G. Einspruch
  • eBook ISBN: 9781483217727

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Description

VLSI Electronics: Microstructure Science, Volume 5 considers trends for the future of very large scale integration (VLSI) electronics and the scientific base that supports its development. This book discusses the automation for VLSI manufacture, silicon material properties for VLSI circuitry, and high-performance computer packaging and thin-film multichip module. The nanometer-scale fabrication techniques, high-density CCD memories, and solid-state infrared imaging are also elaborated. This text likewise covers the impact of microelectronics upon radar systems and quantum-mechanical limitations on device performance. This volume is a good source for scientists and engineers who wish to become familiar with VLSI electronics, device designers concerned with the fundamental character of and limitations to device performance, systems architects who will be charged with tying VLSI circuits together, and engineers conducting work on the utilization of VLSI circuits in specific areas of application.

Table of Contents


  • List of Contributors

    Preface

    Chapter 1 Automation for VLSI Manufacture

    I. Introduction

    II. VLSI Manufacturing Technology

    III. Automation for VLSI Manufacture

    IV. Summary

    References

    Chapter 2 Silicon Material Properties for VLSI Circuitry

    I. Introduction

    II. Fabrication of Silicon Material and VLSI Circuits: A Summary

    III. Silicon Material Phenomena Important for VLSI Circuitry

    IV. Electrical Effects of Point Defects and Crystal Strain on VLSI Circuitry

    V. Historical Perspective on the Evolution of Silicon Material Technology

    VI. Conclusion; Recommendations

    References

    Chapter 3 High-Performance Computer Packaging and the Thin-Film Multichip Module

    I. Introduction—The Trend for High-Performance Computer Packaging

    II. The Multilayer Ceramic Module for LSI Chips

    III. Challenges for Designing Future High-Performance Multichip Modules

    IV. Thin-Film Interconnection Lines

    V. The Delta-I Problem and On-Module Capacitor

    VI. Thin-Film Line Fabrication and the Defect Problem

    VII. Conclusion—The Thin-Film Module as a High-Performance Package

    References

    Chapter 4 Nanometer-Scale Fabrication Techniques

    I. Introduction

    II. Resist Processes and Resolution Limits

    III. Exposure and Patterning Techniques

    IV. Three-Dimensional Techniques

    V. Conclusions

    References

    Chapter 5 High-Density CCD Memories

    I. Introduction

    II. Early Use of Electron-Beam Technology to Fabricate CCDs

    III. MOS RAM versus CCD

    IV. Technology Components

    V. CCD Memory Structure

    VI. Two-Phase Cell

    VII. Channel Stop

    VIII. Barriers

    IX. Maximum Charge Capacity

    X. Processing Error Budgets

    XI. Other Processing Effects

    XII. CCD Array Structures

    XIII. Examples of Device Operation

    XIV. Process Problems

    XV. Technology Status and Forecast

    Appendix. Optimum Cell Layout

    References

    Chapter 6 Solid-State Infrared Imaging

    I. Introduction

    II. Infrared Imaging Principles

    III. Staring and Scanning FPAs

    IV. Infrared Detectors and Readout Structures

    V. Area and Line Arrays

    VI. Array Technologies

    VII. Array Characterization

    VIII. Infrared-Imaging-System Performance

    IX. Concluding Remarks

    References

    Chapter 7 Impact of Microelectronics upon Radar Systems

    I. Overview

    II. System Requirements Drive Technology

    III. Subsystems and Technology Requirements

    IV. Key Microelectronic Technologies

    V. Summary

    Selected References

    Chapter 8 Materials Science, Chemistry, and Physics at Small Dimensions

    I. Materials Science

    II. Chemistry

    III. Physics

    References

    Chapter 9 Quantum-Mechanical Limitations on Device Performance

    I. Fundamental Limits on Logic Devices

    II. Technology-Independent Quantum Limits

    References

    Index

    Contents of Other Volumes

Product details

  • No. of pages: 416
  • Language: English
  • Copyright: © Academic Press 1982
  • Published: September 28, 1982
  • Imprint: Academic Press
  • eBook ISBN: 9781483217727

About the Editor

Norman G. Einspruch

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