Description

Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors.

Readership

Machining process engineers, technicians, researchers and students.

Table of Contents

Introduction to Abrasive Processes Tribosystems of Abrasive Machining Processes Kinematic Models of Abrasive Contacts Contact Mechanics Forces, Friction, and Energy Thermal Design of Processes Molecular Dynamics for Abrasive Process Simulation Fluid Delivery Electrolytic In-Process Dressing (ELID) Grinding and Polishing Grinding Wheel and Abrasive Topography Abrasives and Abrasive Tools Conditioning of Abrasive Wheels Loose Abrasive Processes Process Fluids for Abrasive Machining Tribology of Abrasive Machining Processed Materials

Details

No. of pages:
751
Language:
English
Copyright:
© 2004
Published:
Imprint:
William Andrew
Print ISBN:
9780815514909
Electronic ISBN:
9780815519386