Three-dimensional Integrated Circuit Design

1st Edition

Authors: Visileios Pavlidis Visileios Pavlidis Eby Friedman Eby Friedman
Paperback ISBN: 9780123743435
eBook ISBN: 9780080921860
Imprint: Morgan Kaufmann
Published Date: 25th September 2008
Page Count: 336
70.95 + applicable tax
92.95 + applicable tax
56.99 + applicable tax
86.95 + applicable tax
Unavailable
Compatible Not compatible
VitalSource PC, Mac, iPhone & iPad Amazon Kindle eReader
ePub & PDF Apple & PC desktop. Mobile devices (Apple & Android) Amazon Kindle eReader
Mobi Amazon Kindle eReader Anything else

Institutional Access


Description

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future.

This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits.

Key Features

  • Demonstrates how to overcome "interconnect bottleneck" with 3-D integrated circuit design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers
  • The FIRST book on 3-D integrated circuit design...provides up-to-date information that is otherwise difficult to find
  • Focuses on design issues key to the product development cycle...good design plays a major role in exploiting the implementation flexibilities offered in the 3-D
  • Provides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization...offers practical view of designing 3-D circuits

Readership

VLSI design engineers, CAD Designers of Microprocessors and Systems-on-Chip (SOC), concerned with 3-D integration in chip design...INTERCONNECT, at companies globally such as Microsoft, Honeywell, Intel, AMD, IBM, HP, NVIDIA, Marvell, Texas Instruments, Samsung, Hitachi, Sony, Fujitsu, Toshiba, ST Microelectronics, NXP, Freescale, Infineon, NOKIA, Qualcom, Cadence, Synopsys, Magma, Mentor Graphics, Tezzaron Inc, Ziptronix, Tru-Si, IMEC Belgium, etc.

Table of Contents

Chapter 1. Introduction
1.1. From the Integrated Circuit to the Computer
1.2. Interconnects; an old Friend
1.3. Three-Dimensional or Vertical Integration
1.3.1. Opportunities for Three-Dimensional Integration
1.3.2. Challenges for Three-Dimensional Integration
1.4. Book Organization
Chapter 2. Manufacturing of 3-D Packaged Systems
2.1. Three-Dimensional Integration
2.1.1. System-in-Package
2.1.2. Three-Dimensional Integrated Circuits
2.2. System-on-Package
2.3. Technologies for System-in-Package
2.3.1. Wire Bonded System-in-Package
2.3.2. Peripheral Vertical Interconnects
2.3.3. Area Array Vertical Interconnects
2.3.4. Metallizing the Walls of an SiP
2.4. Cost Issues for 3-D Integrated Systems
2.5. Summary
Chapter 3. 3-D Integrated Circuit Fabrication Technologies
3.1. Monolithic 3-D ICs
3.1.1. Stacked 3-D ICs
3.1.2. 3-D Fin-FETs
3.2. 3-D ICs with Through Silicon (TSV) or Interplane Vias
3.3. Contactless 3-D ICs
3.3.1. Capacitively Coupled 3-D ICs
3.3.2. Inductively Coupled 3-D ICs
3.4. Vertical Interconnects for 3-D ICs
3.4.1. Electrical Characteristics of Through Silicon Vias
3.5. Summary
Chapter 4. Interconnect Prediction Models
4.1. Interconnect Prediction Models for 2-D Circuits
4.2. Interconnect Prediction Models for 3-D ICs
4.3. Projections for 3-D ICs
4.4. Summary
Chapter 5. Physical Design Techniques for 3-D ICs
5.1. Floorplanning Techniques
5.1.1.

Details

No. of pages:
336
Language:
English
Copyright:
© Morgan Kaufmann 2009
Published:
Imprint:
Morgan Kaufmann
eBook ISBN:
9780080921860
Paperback ISBN:
9780123743435

About the Author

Visileios Pavlidis

Vasileios Pavlidis is an Assistant Professor at the School of Computer Science of the University of Manchester. He did his post-doctoral research on 3D integration at the Integrated Systems Laboratory of École polytechnique fédérale de Lausanne, and received masters and doctoral degrees from the University of Rochester, NY. In 2012 he was awarded First Prize in the Innovation Cup, a competition organized by STMicroelectronics, for an application of sensors to analyze the movement of athletes. His interests include interconnect design and analysis, IC design, and related design methodologies.

Affiliations and Expertise

Assistant Professor at the School of Computer Science, University of Manchester, UK

Visileios Pavlidis

Vasileios Pavlidis is an Assistant Professor at the School of Computer Science of the University of Manchester. He did his post-doctoral research on 3D integration at the Integrated Systems Laboratory of École polytechnique fédérale de Lausanne, and received masters and doctoral degrees from the University of Rochester, NY. In 2012 he was awarded First Prize in the Innovation Cup, a competition organized by STMicroelectronics, for an application of sensors to analyze the movement of athletes. His interests include interconnect design and analysis, IC design, and related design methodologies.

Affiliations and Expertise

Assistant Professor at the School of Computer Science, University of Manchester, UK

Eby Friedman

Eby Friedman has been with the Department of Electrical and Computer Engineering at the University of Rochester, Rochester, New York, since 1991, where he is a Distinguished Professor and Director of the High Performance VLSI/IC Design and Analysis Laboratory, and the Director of the Center for Electronic Imaging Systems. He is also a Visiting Professor at the Technion - Israel Institute of Technology. He also directs the Technion Advanced Circuits Research Center (ACRC). His current research and teaching interests are in high performance synchronous digital and mixed-signal microelectronic design and analysis with application to high speed portable processors and low power wireless communications.

Affiliations and Expertise

Distinguished Professor of Electrical and Computer Engineering, University of Rochester, NY, USA

Eby Friedman

Eby Friedman has been with the Department of Electrical and Computer Engineering at the University of Rochester, Rochester, New York, since 1991, where he is a Distinguished Professor and Director of the High Performance VLSI/IC Design and Analysis Laboratory, and the Director of the Center for Electronic Imaging Systems. He is also a Visiting Professor at the Technion - Israel Institute of Technology. He also directs the Technion Advanced Circuits Research Center (ACRC). His current research and teaching interests are in high performance synchronous digital and mixed-signal microelectronic design and analysis with application to high speed portable processors and low power wireless communications.

Affiliations and Expertise

Distinguished Professor of Electrical and Computer Engineering, University of Rochester, NY, USA