Sputtering Materials for VLSI and Thin Film Devices - 1st Edition - ISBN: 9780815515937, 9780815519874

Sputtering Materials for VLSI and Thin Film Devices

1st Edition

Authors: Jaydeep Sarkar
Hardcover ISBN: 9780815515937
eBook ISBN: 9780815519874
Imprint: William Andrew
Published Date: 25th October 2013
Page Count: 608
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Description

Preface

Chapter 1. Sputtering Targets and Sputtered Films for the Microelectronic Industry

1.1 Materials for microelectronics

1.2 Scope of sputtering in microelectronics

1.3 Sputtering materials for integrated circuits

1.4 Sputtering materials for liquid crystal displays

1.5 Sputtering materials for magnetic storage systems

1.6 Sputtering materials for optical storage media

1.7 Sputtering materials for photovoltaic devices

1.8 Sputtering target industry

References

Chapter 2. Sputtering and Thin Film Deposition

2.1 Introduction

2.2 Physical vapor deposition

2.3 Plasma and glow discharge

2.4 Sputter deposition of thin films

2.5 Thin film characteristics

References

Chapter 3. Performance of Sputtering Targets and Productivity

3.1 Introduction

3.2 Target chemistry

3.3 Target metallurgy

3.4 Ferromagnetic targets

3.5 Target cleaning and packaging

3.6 Target burn-in

3.7 Target utilization

References

Chapter 4. Sputtering Target Manufacturing

4.1 Introduction

4.2 Designing sputtering targets

4.3 Target material fabrication

4.4 Machining of target and backing plate

4.5 Bonding methods and bond evaluation

4.6 Particle trap formation

4.7 Degreasing and packaging

References

Chapter 5. Sputtering Targets and Thin Films for Integrated Circuits

5.1 Introduction

5.2 Titanium

5.3 Tungsten

5.4 Tungsten–titanium (W-Ti) alloys

5.5 Aluminum and its alloys

5.6 Tantalum

5.7 Copper and its alloys

5.8 Nickel–vanadium (Ni-V) alloys

5.9 Silicides

References

Chapter 6. Sputtering Targets and Thin Films for Flat Panel Displays and Photovoltaics

6.1 Introduction

6.2 Aluminum and its alloys

6.3 Molybdenum and its alloys

6.4 Chromium

6.5 Transparent conducting oxides (TCOs)

6.6 Absorbers for photovoltaics

References

Chapter 7. Ferromagnetic Sputtering Targets and Thin Films for Silicides and Data Storage

7.1 Introduction

7.2 Nickel and its alloys

7.3 Cobalt and its alloys

7.4 Silicide films

7.5 Media for data storage

References

Chapter 8. Troubleshooting in Sputter Deposition

8.1 Introduction

8.2 Long burn-in of sputtering target

8.3 In-film defect generation

8.4 Bonding-related problems

8.5 Long pump-down time and out-gassing

References

Index

Key Features

  • Unique coverage of sputtering target manufacturing methods in the light of semiconductor, displays, data storage and photovoltaic industry requirements
  • Practical information on technology trends, role of sputtering and major OEMs
  • Discussion on properties of a wide variety of thin films which include silicides, conductors, diffusion barriers, transparent conducting oxides, magnetic films etc.
  • Practical case-studies on target performance and troubleshooting
  • Essential technological information for students, engineers and scientists working in the semiconductor, display, data storage and photovoltaic industry

Readership

Researchers, engineers, undergraduate and graduate students in the fields of semiconductors, displays, thin films (nanotechnology and MEMS) and related industries.

Table of Contents

Preface

Chapter 1. Sputtering Targets and Sputtered Films for the Microelectronic Industry

1.1 Materials for microelectronics

1.2 Scope of sputtering in microelectronics

1.3 Sputtering materials for integrated circuits

1.4 Sputtering materials for liquid crystal displays

1.5 Sputtering materials for magnetic storage systems

1.6 Sputtering materials for optical storage media

1.7 Sputtering materials for photovoltaic devices

1.8 Sputtering target industry

References

Chapter 2. Sputtering and Thin Film Deposition

2.1 Introduction

2.2 Physical vapor deposition

2.3 Plasma and glow discharge

2.4 Sputter deposition of thin films

2.5 Thin film characteristics

References

Chapter 3. Performance of Sputtering Targets and Productivity

3.1 Introduction

3.2 Target chemistry

3.3 Target metallurgy

3.4 Ferromagnetic targets

3.5 Target cleaning and packaging

3.6 Target burn-in

3.7 Target utilization

References

Chapter 4. Sputtering Target Manufacturing

4.1 Introduction

4.2 Designing sputtering targets

4.3 Target material fabrication

4.4 Machining of target and backing plate

4.5 Bonding methods and bond evaluation

4.6 Particle trap formation

4.7 Degreasing and packaging

References

Chapter 5. Sputtering Targets and Thin Films for Integrated Circuits

5.1 Introduction

5.2 Titanium

5.3 Tungsten

5.4 Tungsten–titanium (W-Ti) alloys

5.5 Aluminum and its alloys

5.6 Tantalum

5.7 Copper and its alloys

5.8 Nickel–vanadium (Ni-V) alloys

5.9 Silicides

References

Chapter 6. Sputtering Targets and Thin Films for Flat Panel Displays and Photovoltaics

6.1 Introduction

6.2 Aluminum and its alloys

6.3 Molybdenum and its alloys

6.4 Chromium

6.5 Transparent conducting oxides (TCOs)

6.6 Absorbers for photovoltaics

References

Chapter 7. Ferromagnetic Sputtering Targets and Thin Films for Silicides and Data Storage

7.1 Introduction

7.2 Nickel and its alloys

7.3 Cobalt and its alloys

7.4 Silicide films

7.5 Media for data storage

References

Chapter 8. Troubleshooting in Sputter Deposition

8.1 Introduction

8.2 Long burn-in of sputtering target

8.3 In-film defect generation

8.4 Bonding-related problems

8.5 Long pump-down time and out-gassing

References

Index

Details

No. of pages:
608
Language:
English
Copyright:
© William Andrew 2014
Published:
Imprint:
William Andrew
eBook ISBN:
9780815519874
Hardcover ISBN:
9780815515937

About the Author

Jaydeep Sarkar

Engineering Consultant at Praxair Inc., Orangeburg, New York, USA

Affiliations and Expertise

Engineering Consultant at Praxair Inc., Orangeburg, New York, USA