Silicon Carbide Ceramics

Chapter 1. Introduction: The History and Evolution of SiC Ceramics
1.1. The Early History and Discovery of SiC
1.2. SiC as a Mineral
1.3. The Acheson Process
1.4. The Evolution of SiC Technology Since Acheson
1.5. Applications of SiC Ceramics
1.5.1. SiC Armor Ceramics
1.5.2. SiC Wear Resistant Ceramics
1.5.3. Precision Ceramics
1.5.4. Graphite Coatings
1.5.3. Other Uses of SiC Ceramics
1.6. Powdered SiC Applications
1.6.1. SiC-Based Refractories
1.6.2. SiC Abrasives
1.7. Thin-Film SiC Applications
1.7.1. SiC Semiconductor Thin-Film Technology
1.7.2. SiC Hard/Wear-Resistant Coating Applications
1.7.3. Other SiC Coating Applications
1.8. SiC Ceramics: The Future

Chapter 2. Structure and Properties of SiC Ceramics
2.1. Structure and Crystallography
2.2. Mechanical Properties
2.2.1. Hardness
2.2.2. Elastic Modulus
2.2.3. Strength
2.2.4. Toughness
2.3. Inherent Material Properties
2.3.1. Porosity
2.3.2. Grain size
2.3.3. Purity and Chemical Inertness
2.4. Electrical Properties
2.4.1. Electrical Conductivity
2.4.2. Dopant Effects
2.5. Thermal Properties
2.5.1. Thermal Conductivity
2.5.2. Coefficient of Thermal Expansion and Thermal Shock
2.5.3. Refractoriness
2.5.4. Specific Heat

Chapter 3. HPSC and DSSC: Hot-pressed and Direct-Sintered SiC
3.1. Evolution of HPSC and DSSC
3.2. Raw Materials
3.2.1. Milling Media
3.2.2. Powder Characterisation
3.3. Sintering Aids
3.4. Batching and Mixing
3.5. Forming
3.6. Densification
3.6.1. Furnace Technology
3.6.2. Hot-Pressing Systems
3.6.3. Temperature Measurement
3.6.4. Furnace Cycles – Pressureless Sintering
3.6.5. Microstructure
3.6.6. Safety Considerations
3.7. Quality Control
3.8. HPSC and DSSC Applications
3.9. Conclusions

Chapter 4. RSSC: Reaction Sintered SiC
4.1. Evolution of RSSC
4.2. Mixture Feedstock
4.2.1. SiC Powder
4.2.2. Carbon Precursors
4.3. Forming
4.3.1. Dry forming of RSSC
4.3.2. Wet-Forming of RSSC
4.4. Reaction Sintering
4.4.1. Furnace and Furnace Atmosphere
4.4.2. Temperature Measurement
4.4.3. Silicon Source
4.4.4. Sintering Cycle
4.5. Quality Control
4.7. SiC Reaction Bonded Boron Carbide
4.7. RSSC Applications
4.8. Conclusions

Chapter 5. NBSC: Nitride-Bonded SiC
5.1. Evolution of NBSC
5.2. Batching and Mixing
5.3. Forming
5.4. Sintering
5.4.1. Silicon Content
5.4.2. Sintering Atmosphere
5.4.3. Microstructure
5.6.6. Safety Considerations
5.7. Quality Control
5.8. NBSC Applications
5.9. Conclusions

Chapter 6. Glass-bonded SiC
6.1. Glass-SiC Interactions
6.2. Glass-SiC Grinding Wheel Technology
6.3. Reinforced Glass-SiC Grinding Wheel Technology
6.3. Ultra-Low-Glass Glass-bonded SiC
6.3.1. Reinforcement Technology
6.3.2. Manufacturing Technology
6.3.3. Armour Applications
6.3.4. Wear-Resistant Applications
6.4. Conclusions

Chapter 7. SiC-Reinforced SiC Techology
7.1. The Evolution of SiC-Reinforced SiC Techology
7.2. Applications of SiC-Reinforced SiC Techology
7.3. Manufacture of SiC-Reinforced SiC Techology
7.4. Microstructure of SiC-Reinforced SiC Techology
7.5. Oxidation Performance of SiC-Reinforced SiC Techology
7.6. SiC-Reinforced SiC Techology: The Future

Chapter 8. Non-Ceramic Uses of SiC: Powder and Coating Technologies
8.1.SiC Semiconductor thin Films
8.2. SiC Coatings for Abrasion and Wear Resistance
8.3. Clay Bonded SiC Refractories
8.4. Silicate-Bonded SiC Refractories
8.5. SiC Abrasives