This handbook is a broad review of semiconductor materials and process technology, with emphasis on very large-scale integration (VLSI) and ultra large scale integration (ULSI). The technology of integrated circuit (IC) processing is expanding so rapidly that it can be difficult for the scientist working in one area to keep abreast of developments in other areas of the field. This handbook solves this problem by bringing together "snapshots" of the various aspects of the technology.


Materials scientists and engineers in the semiconductor field.

Table of Contents

Introduction References 1. Silicon Materials Technology Introduction Silicon Crystal Growth Wafer Preparation Material Properties Process-Induced Defects Oxygen in Silicon References 2. The Thermal Oxidation of Silicon and Other Semiconductor Materials Introduction and Background Silicon Thermal Oxidation Kinetics Properties of Thermal Oxides Process Variable/Oxidation Reaction Dependencies Oxidation Mechanism Other Oxidation Processes Future Trends References 3. Chemical Vapor Deposition of Silicon and Its Compounds Introduction Epitaxial Deposition HCI In Situ Etching Gettering Selective Deposition CVD of Dielectric Films X-Ray Lithography Mask Fabrication References 4. Chemical Etching and Slice Cleanup of Silicon Introduction Orientation Dependent Cleaving of Silicon Orientation Dependent Etching and Orientation Dependent Deposition (110) Orientation Dependent Effects Defect Delineation Etching Slice Cleanup Precleanup Solvent Rinse Choline Cleanup Process References 5. Plasma Processing: Mechanisms and Applications Introduction Fundamental Aspects Plasma Etching Plasma Deposition Summary and Conclusions References 6. Physical Vapor Deposition Introduction The Vacuum Environment Evaporation Molecular Beam Epitaxy Sputtering


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© 1988
William Andrew
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