This Proceedings contains the papers presented at the third International Symposium on "Electrochemical Microsystem Technologies", held in Garmisch-Partenkirchen, on 11-15 September 2000.
The papers in this Special Issue are based on the 90 presentations given. In all, 45 papers were accepted, covering many diverse topics, demonstrating the many advances throughout. Due to their emphasis on different fields, they are arranged as follows: Introduction and Fundamentals, Microgalvanics and Microstructuring, Micromaterials and Surface Analysis, Corrosion/Surface Modification, Microanalysis and Applications in Biology, and Nanoelectrochemistry.
Research scientists involved in fundamental electrochemistry, electrode and electrolyte materials, analytical electrochemistry, electrochemical energy conversion, corrosion, electrodeposition and surface treatment, electrochemical engineering, bioelectrochemistry
Chapter headings. Selected papers. Introduction. From micro- to nanotechnology (J.W.Schultze, A. Bressel). Electrochemical microsystem technologies: one example of EMT from ultra-high density magnetic recording (T. Osaka). Hydrodynamic ultramicroelectrodes: kinetic and analytical applications (J.V. Macpherson et al.). Nanoelectrochemitry. Nano-mechano-electrochemistry of passive metal surfaces (M. Seo, M. Chiba). Local pH-controlled reactivity investigations by thin-layer-scanning tunneling microscopy (E. Ammann et al.). AFM induced formation of SiO2 structures in the electrochemical nanocell (H. Bloeß et al.). Electrochemical deposition of fine Pt particles on n-Si electrodes for efficient photoelectrochemical solar cells (S. Yae et al.). Preparation of multilayered Co/Pd nanostructure films by electroplating and their magnetic properties (K. Kudo et al.). Microgalvanics and Microstructuring. Ab initio molecular orbital study of the reaction mechanisms of electroless deposition processes (T. Homma et al.). Pulse reversal plating of Ni and Ni-alloys for microgalvanics (P.T. Tang). Plating technology for electronics packaging (H. Honma). Photolithography based on organosilane self-assembled monolayer resist (H. Sugimura et al.). Materials and Surface Analysis. Electrochemical investigations of single microparticles (T. Hamelmann, M.M. Lohrengel). Electrochemical microcells? (M.M. Lohrengel). Development of an electroformed copper lining for accelerator components (K. Tajiri et al.). Electrochemistry of powder material studied by means of the cavity microelectrode (CME) (C. Cachet-Vivier et al.). Corrosion / Surface mod./ECM. Anodization of Al-Nd alloy films in nonaqueous electrolyte solutions for TFT-LCD application (M. Ue et al.). Local surface modification of aluminum w
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- © Pergamon 2001
- 24th August 2001
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