Reflow Soldering

Reflow Soldering

Apparatus and Heat Transfer Processes

1st Edition - July 2, 2020

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  • Authors: Habil. Illes Balazs, Oliver Krammer, Attila Geczy
  • eBook ISBN: 9780128185063
  • Paperback ISBN: 9780128185056

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Description

Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries.

Key Features

  • Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles
  • Analyses and compares the different reflow ovens
  • Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality
  • Introduces Vapor Phase Soldering (VPS) technology

Readership

Researchers and process and quality engineers within the electronics and manufacturing industries

Table of Contents

  • 1. Introduction to Surface Mounting Technology
    a. Surface Mounted Devices (SMD)
    b. Solder paste and paste deposition technologies
    c. Component placement methods d. The reflow soldering process (thermal profiles, Qη factor)
    e. Types of reflow apparatus and ovens (batch and conveyor types) f. Thermal profiling and fixing thermo-couples

    2. Infrared ovens
    a. Physical background of infrared heating
    b. Structure and working principle of infrared ovens (IR tubes and fans)
    c. Characterization of the heating in infrared ovens
    d. Typical soldering failures in the case of infrared heating

    3. Convection ovens
    a. Physical background of convection heating
    b. Structure and working principle of convection ovens (fan systems and nozzle matrix)
    c. Characterization of the flow parameters (flow velocity and temperature)
    d. Application of flow meters and inside camera systems
    e. Typical soldering failures in the case of convection heating

    4. Vapor Phase Soldering (VPS) ovens
    a. Physical background of condensation heating
    b. Structure and working principle of VPS ovens (heat transfer fluid, immersion heaters)
    c. Characterization of vapor parameters (concentration and temperature)
    d. Application of pressure sensors
    e. Special VPS options (soft and vacuum VPS options) f. Typical soldering failures in the case of condensation heating

    5. Special reflow ovens
    a. Flux-less die attach technology by reflow soldering
    b. Forming gas ovens
    c. Formic acid ovens
    d. Characterization and measurements in special reflow ovens

    6. Numerical simulation of reflow ovens
    a. Numerical simulations of infrared ovens
    b. Numerical simulations of convection ovens
    c. Numerical simulations of VPS ovens
    d. Numerical simulations of special ovens/apparatus

Product details

  • No. of pages: 294
  • Language: English
  • Copyright: © Elsevier 2020
  • Published: July 2, 2020
  • Imprint: Elsevier
  • eBook ISBN: 9780128185063
  • Paperback ISBN: 9780128185056

About the Authors

Habil. Illes Balazs

Dr. habil. Illés Balázs received his Ph.D. degree in electrical engineering from Budapest University of Technology and Economics. He has been involved in convection and vapour phase soldering technologies, reliability of solder joints and numerical simulations. He is the author of 47 journal papers and more than 50 conference papers.

Affiliations and Expertise

Associate professor, Budapest University of Technology, Hungary

Oliver Krammer

Dr. Olivér Krammer, Phd: received his Ph.D. degree in electrical engineering from Budapest University of Technology and Economics. He has been involved in surface mounting technology, soldering technologies, reliability of joining technologies, solder profiling. He is the author of 25 journal papers and more than 50 conference papers.

Affiliations and Expertise

Ph.D. Degree in Electrical Engineering, Budapest University of Technology and Economics

Attila Geczy

Dr. Attila Géczy, Phd: received his Ph.D. degree in electrical engineering from Budapest University of Technology and Economics. He has been involved in vapour phase soldering technology, measurement technologies and numerical simulations. He is the author of 23 journal papers and more than 40 conference papers.

Affiliations and Expertise

Ph.D. Degree in Electrical Engineering, Budapest University of Technology and Economics

Ratings and Reviews

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  • Patrick Thu Jun 04 2020

    Amazing work!

    It is really great to see new perspectives on lead-free soldering. Excellent overview of the soldering process and modelling apparatus!