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Nucleation and Growth of Metals: From Thin Films to Nanoparticles explores how nucleation and growth phenomena condition the morphology and related characteristics of metallic thin films and nanoparticles to help control the functional properties of these objects.
The book brings a rigorous theoretical approach to nucleation and growth phenomena, with a particular focus on the essential aspects and outcomes of this theory. The author explores a general framework for the nucleation and growth of condensed phases from liquid solutions. Practical situations are extensively described, providing state-of-the art information on Cu electroplating and related processes for the fabrication of advanced interconnects and elaboration of metallic nanoparticles.
- Derives the basic equations of nucleation from fundamental thermodynamic and kinetic relations
- Explores the main outcomes of a range of nucleation theories
- Features practical examples to further develop the theoretical aspects
- Provides state-of-the art information on Cu electroplating and related processes for the fabrication of advanced interconnects and elaboration of metallic nanoparticles
Students and young scientists in the fields of thin-films or nanomaterials, or those more generally interested in nucleation phenomena; engineers or industrial practitioners in microelectronics or nanotechnology and related fields
- 1: The Fabrication of Micro- and Nanostructures
- 1.1 The fabrication of advanced interconnect structures in microelectronic devices
- 1.2 Elaboration of metallic NPs
- 1.3 Conclusions
- 2: Phase Transition: Nucleation, Growth, Aggregation and Coalescence
- 2.1 What is the easiest path for a phase transition?
- 2.2 Nucleation
- 2.3 Growth
- 2.4 Aggregation
- 2.5 Coalescence
- 2.6 Conclusions
- 3: The Precipitation of Metals: Thin Film Electroplating and Nanoparticle Synthesis
- 3.1 Principles of metal electroplating
- 3.2 Chemical synthesis of metallic nanoparticles
- 3.3 Conclusions
- 4: Copper Electroplating: from Superconformal to Extreme Fill
- 4.1 Copper electroplating
- 4.2 Superconformal fill of damascene trenches
- 4.3 Extreme fill of TSVs
- 4.4 Conclusions
- 5: Nucleation and Growth of Metallic Thin Films
- 5.1 Seed layer enhancement
- 5.2 Electroless deposition of self-aligned metallic barriers
- 5.3 Conclusions
- 6: Nucleation and Stabilization of Metallic Nanoparticles in Ionic Liquids
- 6.1 What are ionic liquids?
- 6.2 Chemical synthesis of metallic NPs in ILs
- 6.3 Interactions between ILs and NPs
- 6.4 Size evolution of Ru-NPs
- 6.5 Conclusions
- Appendix 1: Demonstration of the General Expression for the Nucleation Rate
- Appendix 2: Stationary Cluster Population and Nucleation Rate
- A2.1 For discrete n values
- A2.2 For continuous n values
- Appendix 3: Where is the Surface of the Cluster?
- List of Acronyms
- No. of pages:
- © ISTE Press - Elsevier 2016
- 22nd July 2016
- ISTE Press - Elsevier
- Hardcover ISBN:
- eBook ISBN:
Paul-Henri Haumesser is a research scientist specializing in electrchemical processes. He received his Master of Materials Science in 1996 and Doctor of Materials Science in 2000, from Paris VI University. Since 2004, he held the position of a scientist atCEA-Leti, researching electrochemical and IL-based processes. Since 2001, he is a member of the executive committee of the Advanced Metallisation Conference (AMC).
Expert Scientist, electrochemical processes