Metallurgical Coatings 1988 - 1st Edition - ISBN: 9781851669851, 9780080984858

Metallurgical Coatings 1988

1st Edition

Proceedings of the 15th International Conference on Metallurgical Coatings, San Diego, CA, U.S.A., April 11–15, 1988

Editors: R Krutenat
eBook ISBN: 9780080984858
Imprint: Elsevier
Published Date: 1st January 1988
Page Count: 412
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Metallurgical coatings 1988 is a compilation of the proceedings of the 15th International Conference on Metallurgical Coatings. This volume is divided into four parts, which deal with synthesis and properties of coatings used in microelectronic applications; methods of characterizing coatings and modified surfaces; protective coatings for magnetic and optical thin film media; and thick and thin film censors.
The first part of this volume is further subdivided into five sections focusing on thin film barrier layers, metallization for VLSI circuits, thin films used in packaging technology, new materials and emerging technologies and synthesis and microstructure of high Tc superconductors. The second part is also subdivided into four sections, each presenting different methods, such as the surface and thin film analysis techniques, microstructural characterization techniques, mechanical properties of films and coatings, and non-destructive characterization techniques.
Part three discusses the preparation and characterization of reactively sputtered silicon nitride thin films, the bond structures and properties of chemically vapor-deposited amorphous SiC, and the wear of Co-Ni thin film magnetic recording tape against metallic and ceramic surfaces. Finally, this volume explores the insert-mounted thin film sensors for real-time.

Table of Contents

Synthesis and Properties of Coatings Used in Microelectronic Applications

Thin film barrier layers

Reaction kinetics in tungsten/barrier metal/silicon systems

Reactively sputtered indium oxide diffusion barrier

Al3Ti formation by diffusion of aluminum through titanium

Chemical stability of vanadium boride with aluminum

Metallization for VLSI circuits

The deposition mechanisms and microstructures of tungsten films produced by silicon reduction of WF6

A comparison of the step coverage of aluminum coatings produced by two sputter magnetron systems and a dual-beam ion system

Reactive-ion-etch-compatible metallization for partially covered contact applications

Effect of encapsulation on the reaction between palladium and GaAs thin films

Thin films used in packaging technology

Process technology for packing applications

Coatings for strain compliance in plastic packages: opportunities and realities

Interface interactions relevant to packaging technology

The reliability of integrated circuits protected with Ti-W/Au bumps

Focused electron and ion beam repair strategies for wafer-scale interconnections in thin film packaging

New materials and emerging technologies

Characterization of HfBx films deposited by r.f. diode and r.f. magnetron sputtering

Ceramic beams and thin film growth

Nitrides of titanium, niobium, tantalum and molybdenum grown as thin films by the atomic layer epitaxy method

In0.30Al0.70As /In0.30Ga0.70As quasi-insulating gate strained-layer field effect transistors grown by molecular beam epitaxy

Synthesis and microstructure of high Tc superconductors

Thermally sprayed coatings of YBa2Cu306 + x

Growth and properties of YBa2Cu307 - x superconducting thin films

Effects of deposition conditions on the superconducting properties of r.f. and d.c. magnetron sputter-deposited YBa2Cu307 - x films

Methods of Characterizing Coatings and Modified Surfaces

Surface and thin film analysis techniques

Analysis of TiN by charged particle beams: nuclear reaction analysis, nuclear reaction broadening and Rutherford backscattering

An evaluation of four computer modelling programs for Rutherford backscattering spectrometry analysis of oxidized surfaces

Resonant low energy electrons and their impact on non-destructive depth profiling of thin film samples

Chemical characterization of the deactivation and protection of FeTi thin films using complementary non-destructive techniques

Microstructural characterization techniques

Structural changes induced by heating in electroless nickel-phosphorus alloys

Plasma spraying o f WO3: structural characterization of the coatings

Electrical insulating properties of r.f.-sputtered magnesia coatings

X-ray microfluorescence analyzer for multilayer metal films

A transmission electron microscopy study on the crystallization of amorphous Ni-P electroless deposited coatings

Structure and properties of ion sulphocarbonitrided coatings on several structural steels

Mechanical properties of films and coatings

Mechanical behavior of aluminum and Al-Cu(2%) thin films

Microhardness and microstructure of ion-beam-sputtered, nitrogen-doped NiFe films

Effects of neutral gas incorporation in molybdenum coatings produced by magnetron sputtering

Non-destructive characterization techniques

Variable angle spectroscopic ellipsometry: a non-destructive characterization technique for ultrathin and multilayer materials

Simultaneous determination of dispersion relation and depth profile of thorium fluoride thin film by spectroscopic ellipsometry

Microscopic bubble formation and collapse at liquid-solid interfaces during electrical powering of thin film structures

Optical second harmonic generation as a probe of interface composition and structure

Slow positron annihilation spectroscopy of heterojunctions and homo-junction s of GaAs-based semiconductor thin films

Protective Coatings for Magnetic and Optical Thin Film Media

Preparation and characterization of reactively sputtered silicon nitride thin films

The bond structures and properties of chemically vapour deposited amorphous SiC

Wear of Co-Ni thin film magnetic recording tape against metallic and ceramic surfaces

Thick and Thin Film Censors

Insert-mounted thin film sensors for real-time monitoring of tool conditions

Author Index

Subject Index


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About the Editor

R Krutenat

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