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As engineering materials and structures often contain a metal or metallic alloy bonded to a ceramic, the resultant interface must be able to sustain mechanical forces without failure. They also play an important role in oxidation or reduction of materials. The workshop on 'Bonding, Structure and Mechanical Properties of Metal/Ceramic Interfaces' was held in January 1989 within the Acta/Scripta Metallurgica conference series. It drew together an international collection of 70 scientists who discussed a wide range of issues related to metal-ceramic interfaces. The sessions were divided into 7 categories: structure and bonding, chemistry at interfaces, formation of interfaces, structure of interfaces, thermodynamics/atomistics of interface fracture, mechanics of interface cracks, and fracture resistance of bimaterial interfaces. Within these headings attention was paid to grain boundaries, the influence of chemical processes on the behaviour of interfaces, diffusion bonding, characterization of fracture, and crack propagation by fatigue and by stress corrosion. The book presents a useful reference source for materials scientists, physicists, chemists, and mechanical engineers who are concerned with the roles and properties of interfaces.
For materials scientists, physicists, chemists and mechanical engineers interested in the properties and structure of metal-ceramic interfaces.
Section headings and selected papers: Structure and Bonding. Energetics, bonding mechanism and electronic structure of metal-ceramic interfaces, A J Freeman et al. Universal energy relations and metal-ceramic interfaces, J R Smith et al. Approaches to modelling metal-ceramic interfaces, M W Finnis et al. Bonds, the transition state and fracture, M E Eberhart et al. Chemistry at Interfaces. Physiochemical processes at metal-ceramic interfaces, M Backhaus-Ricoult. Ferrite-metal interfacial reaction, J T Klomp & A J v d Ven. Structure and chemistry of the TI-Sapphire interface, R Peddada et al. Interface reactions and phase stability in the Al-SiC system, C A Handwerker et al. Formation of Interfaces. The formation of metal-ceramic interfaces by diffusion bonding, B Derby. Interfacial structure and bonding strength of silicon nitride ceramics brazed with aluminum, T Okamoto et al. Structure and Defects at Interfaces. High resolution electron microscopy: possibilities and limitations, P Pirouz & F Ernst. High-resolution electron microscopy of metal-ceramic interfaces, K L Merkle. Atomic imaging and interfacial analysis, C J D Hetherington & G Thomas. Mechanics and Thermodynamics of Fracture. Mechanics and thermodynamics of brittle interfacial failure in bimaterials systems, J R Rice et al. Cracks on bimaterial interfaces: plasticity aspects, C F Shih et al. Fracture Resistance of Bimaterial Interfaces. The fracture energy of bimaterial interfaces, A G Evans et al. Crack growth on bimaterial interfaces, A G Varias et al. Interface cracks between anisotropic elastic solids, J Qu & J L Bassani.
- © Pergamon 1990
- 23rd May 1990
- eBook ISBN:
Max-Planck Institut für Metallforschung, Germany
University of California, USA
Washington State University, USA
Royal Society Research Professor Emeritus at Cambridge University and Former Visiting Professor of Design at the Royal College of Art, London, UK
Mike Ashby is sole or lead author of several of Elsevier’s top selling engineering textbooks, including Materials and Design: The Art and Science of Material Selection in Product Design, Materials Selection in Mechanical Design, Materials and the Environment, and Materials: Engineering, Science, Processing and Design. He is also coauthor of the books Engineering Materials 1&2, and Nanomaterials, Nanotechnologies and Design.
Royal Society Research Professor Emeritus, University of Cambridge, and Former Visiting Professor of Design at the Royal College of Art, London
@from:Ajay K Mistra @qu:This book will serve as a good reference for researchers, particularly those with an interest in basic research, working in the areas of metal-ceramic joining, ceramic-ceramic joining, electronic packaging, and composite materials. Also because of a number of review papers and extensive references cited in these papers, the book will be very useful to researchers who are new to the field. @source:Ceramic Abstracts Vol 70 No 9/10
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