Materials Science of Thin Films

Materials Science of Thin Films

Depositon & Structure

2nd Edition - October 15, 2001

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  • Author: Milton Ohring
  • Hardcover ISBN: 9780125249751
  • eBook ISBN: 9780080491783

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Description

This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.

Readership

Advanced undergraduate and first-year graduate students in materials science and electrical engineering; researchers in industrial in-house courses, or short courses offered by professional societies

Table of Contents

  • Chapter 1 A Review of Materials Science
    1.1. Introduction
    1.2. Structure
    1.3. Defects in Solids
    1.4. Bonds and Bands in Materials
    1.5. Thermodynamics of Materials
    1.6. Kinetics
    1.7. Nucleation
    1.8. An Introduction to Mechanical Behavior
    1.9. Conclusion
    Exercises
    References
    Chapter 2 Vacuum Science and Technology
    2.1. Introduction
    2.2. Kinetic Theory of Gases
    2.3. Gas Transport and Pumping
    2.4. Vacuum Pumps
    2.5. Vacuum Systems
    2.6. Conclusion
    Exercises
    References
    Chapter 3 Thin-Film Evaporation Processes
    3.1. Introduction
    3.2. The Physics and Chemistry of Evaporation
    3.3. Film Thickness Uniformity and Purity
    3.4. Evaporation Hardware
    3.5. Evaporation Processes and Applications
    3.6. Conclusion
    Exercises
    References
    Chapter 4 Discharges, Plasmas, and Ion-Surface Interactions
    4.1. Introduction
    4.2. Plasmas, Discharges, and Arcs
    4.3. Fundamentals of Plasma Physics
    4.4. Reactions in Plasmas
    4.5. Physics of Sputtering
    4.6. Ion Bombardment Modification of Growing Films
    4.7. Conclusion
    Exercises
    References
    Chapter 5 Plasma and Ion Beam Processing of Thin Films
    5.1. Introduction
    5.2. DC, AC, and Reactive Sputtering Processes
    5.3. Magnetron Sputtering
    5.4. Plasma Etching
    5.5. Hybrid and Modified PVD Processes
    5.6. Conclusion
    Exercises
    References
    Chapter 6 Chemical Vapor Deposition
    6.1. Introduction
    6.2. Reaction Types
    6.3. Thermodynamics of CVD
    6.4. Gas Transport
    6.5. Film Growth Kinetics
    6.6. Thermal CVD Processes
    6.7. Plasma-Enhanced CVD Processes
    6.8. Some CVD Materials Issues
    6.9. Safety
    6.10. Conclusion
    Exercises
    References
    Chapter 7 Substrate Surfaces and Thin-Film Nucleation
    7.1. Introduction
    7.2. An Atomic View of Substrate Surfaces
    7.3. Thermodynamic Aspects of Nucleation
    7.4. Kinetic Processes in Nucleation and Growth
    7.5. Experimental Studies of Nucleation and Growth
    7.6. Conclusion
    Exercises
    References
    Chapter 8 Epitaxy
    8.1. Introduction
    8.2. Manifestations of Epitaxy
    8.3. Lattice Misfit and Defects in Epitaxial Films
    8.4. Epitaxy of Compound Semiconductors
    8.5. High-Temperature Methods for Depositing Epitaxial Semiconductor Films
    8.6. Low-Temperature Methods for Depositing Epitaxial Semiconductor Films
    8.7. Mechanisms and Characterization of Epitaxial Film Growth
    8.8. Conclusion
    Exercises
    References
    Chapter 9 Film Structure
    9.1. Introduction
    9.2. Structural Morphology of Deposited Films and Coatings
    9.3. Computational Simulations of Film Structure
    9.4. Grain Growth, Texture, and Microstructure Control in Thin Films
    9.5. Constrained Film Structures
    9.6. Amorphous Thin Films
    9.7. Conclusion
    Exercises
    References
    Chapter 10 Characterization of Thin Films and Surfaces
    10.1. Introduction
    10.2. Film Thickness
    10.3. Structural Characterization of Films and Surfaces
    10.4. Chemical Characterization of Surfaces and Films
    10.5. Conclusion
    Exercises
    References
    Chapter 11 Interdiffusion, Reactions, and Transformations in Thin Films
    11.1. Introduction
    11.2. Fundamentals of Diffusion
    11.3. Interdiffusion in Thin Metal Films
    11.4. Compound Formation and Phase Transformations in Thin Films
    11.5. Metal-Semiconductor Reactions
    11.6. Mass Transport in Thin Films under Large Driving Forces
    11.7. Conclusion
    Exercises
    References
    Chapter 12 Mechanical Properties of Thin Films
    12.1. Introduction
    12.2. Mechanical Testing and Strength of Thin Films
    12.3. Analysis of Internal Stress
    12.4. Techniques for Measuring Internal Stress in Films
    12.5. Internal Stresses in Thin Films and Their Causes
    12.6. Mechanical Relaxation Effects in Stressed Films
    12.7. Adhesion
    12.8. Conclusion
    Exercises
    References

Product details

  • No. of pages: 816
  • Language: English
  • Copyright: © Academic Press 2001
  • Published: October 15, 2001
  • Imprint: Academic Press
  • Hardcover ISBN: 9780125249751
  • eBook ISBN: 9780080491783

About the Author

Milton Ohring

Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.

Affiliations and Expertise

Stevens Institute of Technology, Hoboken, NJ, USA (Retired)

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