Materials for Electronic Packaging

Materials for Electronic Packaging

1st Edition - March 31, 1995

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  • Author: Deborah Chung
  • eBook ISBN: 9780080511177

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Description

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

Key Features

  • Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors
  • Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science
  • Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems

Readership

Professionals and advanced graduate students working in electronic materials and packaging

Table of Contents

  • Overview of materials for electronic packaging
    Solderability fundamentals: role of microscopic processes
    Determining the damaging strains which cause failure in lead tin solders
    Fluxless soldering for microelectronic applications, The effect of microstructure on the bonding of metal/ceramic interfaces
    The future of advanced composite electronic packaging
    Low thermal expansion composite materials for electronic packaging
    Electrically conducting polymer-matrix composites
    Thick-film technology
    Electroless copper for micropackaging and ultra large scale integrated circuit applications
    Vacuum metallization for integrated circuit packages
    Electrically conducting polymers and organic materials
    Diamond films
    Measurements of properties of materials in electronic packaging

Product details

  • No. of pages: 368
  • Language: English
  • Copyright: © Butterworth-Heinemann 1995
  • Published: March 31, 1995
  • Imprint: Butterworth-Heinemann
  • eBook ISBN: 9780080511177

About the Author

Deborah Chung

Professor Deborah D.L. Chung, Composite Materials Research Laboratory, University at Buffalo, State University of New York

Affiliations and Expertise

Composite Materials Research Laboratory, University at Buffalo, State University of New York.

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