Materials for Electronic Packaging - 1st Edition - ISBN: 9780750693141, 9780080511177

Materials for Electronic Packaging

1st Edition

Authors: Deborah Chung
Hardcover ISBN: 9780750693141
eBook ISBN: 9780080511177
Imprint: Butterworth-Heinemann
Published Date: 31st March 1995
Page Count: 368
Tax/VAT will be calculated at check-out
Compatible Not compatible
VitalSource PC, Mac, iPhone & iPad Amazon Kindle eReader
ePub & PDF Apple & PC desktop. Mobile devices (Apple & Android) Amazon Kindle eReader
Mobi Amazon Kindle eReader Anything else

Institutional Access


Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.

The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

Key Features

Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors. Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science. Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems.


Professionals and advanced graduate students working in electronic materials and packaging.

Table of Contents

Overview of materials for electronic packaging; Solderability fundamentals: role of microscopic processes; Determining the damaging strains which cause failure in lead tin solders; Fluxless soldering for microelectronic applications, The effect of microstructure on the bonding of metal/ceramic interfaces; The future of advanced composite electronic packaging; Low thermal expansion composite materials for electronic packaging; Electrically conducting polymer-matrix composites; Thick-film technology; Electroless copper for micropackaging and ultra large scale integrated circuit applications; Vacuum metallization for integrated circuit packages; Electrically conducting polymers and organic materials; Diamond films; Measurements of properties of materials in electronic packaging.


No. of pages:
© Butterworth-Heinemann 1995
eBook ISBN:
Hardcover ISBN:

About the Author

Deborah Chung

Professor Deborah D.L. Chung, Composite Materials Research Laboratory, University at Buffalo, State University of New York

Affiliations and Expertise

Composite Materials Research Laboratory, University at Buffalo, State University of New York.