Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

Key Features

Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors. Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science. Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems.


Professionals and advanced graduate students working in electronic materials and packaging.

Table of Contents

Overview of materials for electronic packaging; Solderability fundamentals: role of microscopic processes; Determining the damaging strains which cause failure in lead tin solders; Fluxless soldering for microelectronic applications, The effect of microstructure on the bonding of metal/ceramic interfaces; The future of advanced composite electronic packaging; Low thermal expansion composite materials for electronic packaging; Electrically conducting polymer-matrix composites; Thick-film technology; Electroless copper for micropackaging and ultra large scale integrated circuit applications; Vacuum metallization for integrated circuit packages; Electrically conducting polymers and organic materials; Diamond films; Measurements of properties of materials in electronic packaging.


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© 1995
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About the author

Deborah Chung

Professor Deborah D.L. Chung, Composite Materials Research Laboratory, University at Buffalo, State University of New York

Affiliations and Expertise

Composite Materials Research Laboratory, University at Buffalo, State University of New York.