Integrated Photonics for Data Communication Applications

Integrated Photonics for Data Communication Applications

1st Edition - January 1, 2023

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  • Editors: Madeleine Glick, Ling Liao, Katharine Schmidtke
  • Paperback ISBN: 9780323912242

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Integrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic devices to integrated photonic circuits. The book presents an overview of the trends and commercial needs of data communication in data centers and high-performance computing, with contributions from end users presenting key performance indicators. In addition, the fundamental building blocks are reviewed, along with the devices (lasers, modulators, photodetectors and passive devices) that are the individual elements that make up the photonic circuits. These chapters include an overview of device structure and design principles and their impact on performance. Following sections focus on putting these devices together to design and fabricate application-specific photonic integrated circuits to meet performance requirements, along with key areas and challenges critical to the commercial manufacturing of photonic integrated circuits and the supply chains being developed to support innovation and market integration are discussed. This series is led by Dr. Lionel Kimerling Executive at AIM Photonics Academy and Thomas Lord Professor of Materials Science and Engineering at MIT and Dr. Sajan Saini Education Director at AIM Photonics Academy at MIT. Each edited volume features thought-leaders from academia and industry in the four application area fronts (data communications, high-speed wireless, smart sensing, and imaging) and addresses the latest advances.

Key Features

  • Includes contributions from the leading experts and end-users across academia and industry working on the most exciting research directions of integrated photonics for data communications applications
  • Provides an overview of data communication specific integrated photonics, starting from fundamental building block devices to photonic integrated circuits and manufacturing tools and processes
  • Presents key performance metrics, design principles, performance impact of manufacturing variations and operating conditions, as well as pivotal performance benchmarks


Materials Scientists and Engineers; Electrical and Optical Engineers

Table of Contents

  • 1. End users and key performance indicators

    Part I: Fundamental Building Block Photonic Devices
    2. Lasers
    3. Optical Modulators
    4. Photodetectors
    5. Passive Optical Devices

    Part II: Photonic Integrated Circuits
    6. XPU-XPU / XPU-memory interconnects
    7. Network / Switch interconnect (incl. Optical switching)
    8. DCI - coherent

    Part III: Tools and Supply Chain
    9. Software design tools
    10. Chip Fabrication, and chip integration approaches, test
    11. Assembly & Packaging approaches for DC and HPC
    12. Quality and reliability for DC HPC

Product details

  • No. of pages: 450
  • Language: English
  • Copyright: © Elsevier 2023
  • Published: January 1, 2023
  • Imprint: Elsevier
  • Paperback ISBN: 9780323912242

About the Editors

Madeleine Glick

Dr. Madeleine Glick received her Ph.D. in Physics from Columbia University after which she joined the Department of Physics, Ecole Polytechnique Federale de Lausanne (EPFL) Lausanne, Switzerland, continuing research in electro-optic effects in III-V materials. From 1992 to 1996, she was a Research Associate with CERN, Geneva, Switzerland. From 2002-2011 Madeleine was Principal Engineer at Intel (Intel Research Cambridge UK, Intel Research Pittsburgh, PA) leading research on optical interconnects for data centers. Her research interests are in applications of photonic devices and optical interconnects to computing systems. Madeleine is a Senior Member of IEEE and OSA.

Affiliations and Expertise

Department of Physics, Ecole Polytechnique Federale de Lausanne (EPFL) Lausanne, Switzerland

Ling Liao

Dr. Liao Ling is an Intel Fellow and chief architect of photonic integration in Intel’s Silicon Photonic Product Division. She joined Intel in 1997 and spearheaded pioneering research in high speed silicon modulation, optical transmitter integration, and now co-packaged optics. Her worked played a big part in transforming Silicon Photonics from being a niche technical interest 20 years ago to the now key enabling technology that is revolutionizing data center connectivity. Ling currently leads the development of multi terabit per second photonic engines to co-package optics with switch SOCs and XPUs for future power, cost, and bandwidth density scaling. Ling is the recipient of two Intel Achievement Awards (2004 and 2017), the 2006 MIT Technology Review Innovator Under 35 Award, and the 2014 Optical Society Paul F. Forman Engineering Excellence Team Award. She has authored chapters in four books as well as over 50 journal and conference papers. She has nine issued patents and three pending. Ling earned her bachelor’s and master’s degrees in materials science and engineering from the Massachusetts Institute of Technology and PhD degree in electrical engineering from the University of Surrey, England.

Affiliations and Expertise

Intel Fellow and Chief Architect of Photonic Integration, Intel’s Silicon Photonic Product Division, USA

Katharine Schmidtke

Dr. Katharine Schmidtke is Director of Sourcing for ASICs and Custom Silicon at Facebook. Over the past five years she led Facebook’s Optical Technology strategy and worked closely with OCP to specify the 100G-CWDM4-OCP optical transceiver optimized for data center applications. Katharine obtained a Ph.D. in non-linear optics from Southampton University in the UK and completed post-doctoral research at Stanford University.

Affiliations and Expertise

Director of Sourcing for ASICs and Custom Silicon, Facebook

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