The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.


Materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.

Table of Contents

1. Introduction 1.0 Classification of Materials for Microelectronics 2.0 Classification of Processes 3.0 Definition and Characteristics of Hybrid Circuits 4.0 Applications References 2. Substrates 1.0 Functions 2.0 Surface Characteristics 3.0 Alumina Substrates 4.0 Beryllia Substrates 5.0 Aluminum Nitride 6.0 Metal Matrix Composites 7.0 Ceramic Substrate Manufacture 8.0 Enameled Metal Substrates 9.0 Quality Assurance and Test Methods References 3. Thin Film Processes 1.0 Deposition Processes 2.0 Thin Film Resistor Processes 3.0 Photoresist Materials and Processes 4.0 Etching Materials and Processes 5.0 Thin-Film Microbridge Crossover Circuits References 4. Thick Film Processes 1.0 Fabrication Processes 2.0 Direct Writing 3.0 Paste Materials 4.0 Non-Noble-Metal Thick Films 5.0 Polymer Thick Films References 5. Resistor Trimming 1.0 Laser Trimming 2.0 Abrasive Trimming 3.0 Resistor Probing/Measurement Techniques 4.0 Types of Resistor Trims 5.0 Special Requirements References 6. Parts Selection 1.0 General Considerations 2.0 Packages 3.0 Active Devices 4.0 Passive Devices References 7. Assembly Processes 1.0 Introduction 2.0 Die and Substrate Attachment 3.0 Interconnections 4.0 Cleaning 5.0 Particle Immobilizing Coatings 6.0 Vacuum-Baking and Se


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© 1998
William Andrew
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