
High Power Impulse Magnetron Sputtering
Fundamentals, Technologies, Challenges and Applications
Resources
Description
Key Features
- Includes a comprehensive description of the HiPIMS process from fundamental physics to applications
- Provides a distinctive link between the process plasma and thin film communities
- Discusses the industrialization of HiPIMS and its real world applications
Readership
Researchers within the Vacuum equipment, semiconductor, automotive, aeronautic, glass, and medical applications industries and academics within the Materials science, plasma physics, and nanomaterials areas
Table of Contents
1. Introduction (particle surface interaction)
o Sputtering (background)
o Magnetron sputtering
o Magnetron configurations
o Overview of pulsed magnetron discharges
2. Power coupling
o HiPIMS generator
o HiPIMS bias
o Multi-cathode configurations
o Superposition
3. HiPIMS process characteristics
o Electrons: Electron energy, electron density, and electrical potentials
o Ions: Ion flux, energy, and composition
o Deposition rate
o Self-sputtering
4. Reactive HiPIMS
o Fundamentals
o Experimental results
5. HiPIMS modeling
o Types
o Results
6. Physics of HiPIMS
o Deposition rate
o Transport of charged species
o Modes of operation
o Reactive HiPIMS
7. HiPIMS thin films
o Deposition on complex-shaped substrates
o Phase composition tailoring
o Control of film microstructure
o Interface engineering
o Protecting films (corrosion, hardness, adhesion etc)
o Films for electronic applications
8. Industrialization of HiPIMS
o Up-scaling
o Rotating magnetron sputtering
o Examples of industrially relevant thin films
Product details
- No. of pages: 398
- Language: English
- Copyright: © Elsevier 2019
- Published: August 28, 2019
- Imprint: Elsevier
- eBook ISBN: 9780128124550
- Paperback ISBN: 9780128124543
About the Editors
Daniel Lundin
Affiliations and Expertise
Tiberiu Minea
Affiliations and Expertise
Jon Tomas Gudmundsson
Affiliations and Expertise
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