Description

New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.

Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

Readership

New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries.

Table of Contents

Foreword: Gordon Moore
Recent Changes in the Semiconductor Industry
Krishna Seshan
1.0 Cost of Device Fabrication
2.0 Technology Trends, Chip Size, Performance, and Moore's Law
1. Deposition Technologies and Applications: Introduction and Overview
Werner Kern and Klaus K. Schuegraf
1.0 Objective and Scope of this Book
2.0 Importance of Deposition Technology in Modern Fabrication Processes
3.0 Classification of Deposition Technologies
4.0 Overview of Various Thin Film Deposition Technologies
5.0 Criteria for the Selection of a Deposition Technology for Specific Applications
6.0 Summary and Perspective for the Future
2. Silicon Epitaxy by Chemical Vapor Deposition
Martin L. Hammond
1.o Introduction
2.0 Theory of Silicon Epitaxy by CVD
3.0 Silicon Epitaxy Process Chemistry
4.0 Commercial Reactor Geometries
5.0 Theory of Chemical Vapor Deposition
6.0 Process Adjustments
7.0 Equipment Considerations for Silicon Epitaxy
8.0 Other Equipment Considerations
9.0 Defects in Epitaxy Layers
10.0 Safety
11.0 Key Technical Issues
12.0 New Materials Technology for Silicon Epitaxy
13.0 Low Temperature Epitaxy
3. Chemical Vapor Deposition of Silicon Dioxide Films
John Foggiato
1.0 Introduction
2.0 Overview of Atmospheric Pressure CVD
3.0 Plasma Enhanced CVD
4.0 Properties of Dielectric Films
5.0 New Deposition Technologies
6.0 Future Directions for CVD of Dielectric Films
4. Metal Organic Chemical Vapor Deposition

Details

No. of pages:
430
Language:
English
Copyright:
© 2001
Published:
Imprint:
William Andrew
Print ISBN:
9780815514428
Electronic ISBN:
9780815517788