The Handbook of Silicon Wafer Cleaning Technology, Third Edition provides an in-depth discussion of cleaning, etching, and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing is reviewed, including surface and colloidal aspects. The book has been revised to include the developments of the last 10 years to accommodate a continually involving industry and new technologies.
This new edition addresses new material such as germanium and III-V compound semiconductors.
The handbook reviews the various techniques and methods for cleaning and surface conditioning. The text provides the reader help in understanding the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination; metal, particle, and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon, and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination.
The book is arranged in an order that segments the various cleaning techniques; aqueous and dry processing. The sections are arranged with theory, chemistry, and physics first, and then going into detail for the various methods of cleaning; particle removal and metal removal for example. The chapters have numerous examples of the cleaning technique and the results.
- Focused on cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits
- As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries
- Covers processes and equipment, as well as new materials and changes required for the surface conditioning process
Managers, engineers, and technicians that manufacture integrated circuits or supply the semiconductor and microelectronics industries
Part 1: Introduction and Overview
1. Overview and Evolution of Silicon Wafer Cleaning Technology
2. Overview of Wafer Contamination and Defectivity
Part 2: Wet-Chemical Processes
3. Particle Deposition and Adhesion
4. Aqueous Cleaning and Surface Conditioning Processes
Part 3: Dry Cleaning Processes
5. Gas-phase Wafer Cleaning Technology
6. Plasma Stripping and Cleaning
7. Cryogenic Aerosols and Supercritical Fluid Cleaning
Part 4: Analytical and Control Aspects
8. Detection and Measurement of Particulate Contaminants
9. Surface Chemical Composition and Morphology
10. Ultratrace Impurity and Surface Morphology Analysis
- No. of pages:
- © William Andrew 2018
- 1st October 2017
- William Andrew
- Paperback ISBN:
Karen A. Reinhardt is Principle Consultant at Cameo Consulting in San Jose, California. At Cameo Consulting she assists companies investigating and assessing new and unique cleaning technologies that will allow realization of the ITRS roadmap with respect to smaller geometries, new materials, and the environmental issues associated with current cleaning processes. Karen has published over 30 technical papers ranging from plasma processing to damage characterization and cleaning technology assessment. She has been awarded eight patents. Karen formerly co-chaired the ITRS Surface Preparation Technical Working Group. Prior to forming a contracting and consulting company, Karen was employed at Novellus Systems and Advanced Micro Devices. Karen has a BS degree in Chemistry from the University of California at Riverside and a MS degree in Inorganic Chemistry from Texas Tech University.
Cameo Consulting, San Jose, California, U.S.A
Lam Research, San Diego, California